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Fingerprint Dive into the research topics where Hideharu Amano is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

  • 3 Similar Profiles
Field programmable gate arrays (FPGA) Engineering & Materials Science
Particle accelerators Engineering & Materials Science
Data storage equipment Engineering & Materials Science
Parallel processing systems Engineering & Materials Science
Hardware Engineering & Materials Science
Routers Engineering & Materials Science
Switches Engineering & Materials Science
Communication Engineering & Materials Science

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Research Output 1983 2019

A coarse grained-reconfigurable accelerator with energy efficient MTJ-based non-volatile flip-flops

Ikezoe, T., Amano, H., Akaike, J., Usami, K., Kudo, M., Hiraga, K., Shuto, Y. & Yagami, K., 2019 Feb 13, 2018 International Conference on Reconfigurable Computing and FPGAs, ReConFig 2018. Andrews, D., Feregrino, C., Cumplido, R. & Stroobandt, D. (eds.). Institute of Electrical and Electronics Engineers Inc., 8641712. (2018 International Conference on Reconfigurable Computing and FPGAs, ReConFig 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Flip flop circuits
Particle accelerators
Data storage equipment
Managers
Inventory control

A fine-grained multicasting of configuration data for coarse-grained reconfigurable architectures

Kojima, T. & Amano, H., 2019 Jan 1, In : IEICE Transactions on Information and Systems. E102D, 7, p. 1247-1256 10 p.

Research output: Contribution to journalArticle

Open Access
Reconfigurable architectures
Multicasting
Processing
Program processors
Energy utilization

Implementing a large application(LSTM) on the multi-FPGA system: Flow-in-Cloud

Yamauchi, Y., Musha, K. & Amano, H., 2019 May 23, IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL CHIPS 2019 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 8721333. (IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL CHIPS 2019 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Field programmable gate arrays (FPGA)
Cloud computing
Long short-term memory
Engines
Tensors

Key-value Store Chip Design for Low Power Consumption

Tokusashi, Y., Matsutani, H. & Amano, H., 2019 May 23, IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL CHIPS 2019 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 8721352. (IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL CHIPS 2019 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electric power utilization
Bias voltage
Tuning
Application programming interfaces (API)
Embedded systems

Level-Shifter-Less Approach for Multi-VDD SoC Design to Employ Body Bias Control in FD-SOI

Usami, K., Kogure, S., Yoshida, Y., Magasaki, R. & Amano, H., 2019 Jan 1, VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things - 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Revised and Extended Selected Papers. Monteiro, J., Elfadel, I. A. M., Sonza Reorda, M., Ugurdag, H. F., Maniatakos, M. & Reis, R. (eds.). Springer New York LLC, p. 1-21 21 p. (IFIP Advances in Information and Communication Technology; vol. 500).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Simulation
Costs
Temperature