• Source: Scopus
  • Calculated based on no. of publications stored in Pure and citations from Scopus
20002021

Research activity per year

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  • 2018

    Prediction of shear length in blanking process by numerical analysis

    Sato, S. & Omiya, M., 2018, Technology of Plasticity. Wang, G-J., Fann, K-J., Hwang, Y-M. & Jiang, C-P. (eds.). Trans Tech Publications Ltd, p. 181-186 6 p. (Materials Science Forum; vol. 920 MSF).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 2015

    Evaluation of adhesion energy and its correlation to apparent strength for Cu/SiN interface in copper damascene interconnect structures

    Kamiya, S., Chen, C., Shishido, N., Omiya, M., Koiwa, K., Sato, H., Nishida, M., Suzuki, T., Nakamura, T., Nokuo, T. & Suzuki, T., 2015 Nov 10, 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015. Institute of Electrical and Electronics Engineers Inc., p. 151-153 3 p. 7325649. (2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)
  • Scenario for catastrophic failure in interconnect structures under chip package interaction

    Omiya, M., Kamiya, S., Shishido, N., Koiwa, K., Sato, H., Nishida, M., Suzuki, T., Nakamura, T., Suzuki, T. & Nokuo, T., 2015 May 26, 2015 IEEE International Reliability Physics Symposium, IRPS 2015. Institute of Electrical and Electronics Engineers Inc., p. 5C31-5C35 7112751. (IEEE International Reliability Physics Symposium Proceedings; vol. 2015-May).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 2014

    Crack propagation resistance in thickness direction of Proton exchange membrane (PEM)

    Sasaki, Y., Kai, Y., Omiya, M., Uchiyama, T. & Kumei, H., 2014 Jan 1, ASME 2014 12th International Conference on Fuel Cell Science, Engineering and Technology, FUELCELL 2014 Collocated with the ASME 2014 8th International Conference on Energy Sustainability. Web Portal ASME (American Society of Mechanical Engineers), (ASME 2014 12th International Conference on Fuel Cell Science, Engineering and Technology, FUELCELL 2014 Collocated with the ASME 2014 8th International Conference on Energy Sustainability).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 2013

    Deformation behavior of Ionic Polymer Metal Composite actuator in several pH solutions

    Omiya, M. & Aoyagi, W., 2013 Jun 12, Electroactive Polymer Actuators and Devices (EAPAD) 2013. 868724. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 8687).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Macroscopic and microscopic interface adhesion strength of copper damascene interconnects

    Shishido, N., Kamiya, S., Chen, C., Sato, H., Koiwa, K., Omiya, M., Nishida, M., Suzuki, T., Nakamura, T., Nokuo, T. & Suzuki, T., 2013, Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013. 6615564. (Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    2 Citations (Scopus)
  • 2012

    Crack formation on membrane electrode assembly (Mea) under static and cyclic loadings

    Kai, Y., Kitayama, Y., Omiya, M., Uchiyama, T. & Kato, M., 2012 Jan 1, ASME 2012 10th International Conference on Fuel Cell Science, Engineering and Technology Collocated with the ASME 2012 6th International Conference on Energy Sustainability, FUELCELL 2012. American Society of Mechanical Engineers (ASME), p. 143-151 9 p. (ASME 2012 10th International Conference on Fuel Cell Science, Engineering and Technology Collocated with the ASME 2012 6th International Conference on Energy Sustainability, FUELCELL 2012).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    5 Citations (Scopus)
  • Infrared Doppler instrument for the Subaru telescope (IRD)

    Tamura, M., Suto, H., Nishikawa, J., Kotani, T., Sato, B., Aoki, W., Usuda, T., Kurokawa, T., Kashiwagi, K., Nishiyama, S., Ikeda, Y., Hall, D., Hodapp, K., Hashimoto, J., Morino, J., Inoue, S., Mizuno, Y., Washizaki, Y., Tanaka, Y., Suzuki, S. & 34 others, Kwon, J., Suenaga, T., Oh, D., Narita, N., Kokubo, E., Hayano, Y., Izumiura, H., Kambe, E., Kudo, T., Kusakabe, N., Ikoma, M., Hori, Y., Omiya, M., Genda, H., Fukui, A., Fujii, Y., Guyon, O., Harakawa, H., Hayashi, M., Hidai, M., Hirano, T., Kuzuhara, M., Machida, M., Matsuo, T., Nagata, T., Ohnuki, Y., Ogihara, M., Oshino, S., Suzuki, R., Takami, H., Takato, N., Takahashi, Y., Tachinami, C. & Terada, H., 2012, Ground-Based and Airborne Instrumentation for Astronomy IV. 84461T. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 8446).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    52 Citations (Scopus)
  • 2011

    A microscopic study on local strain rate sensitivity of polypropylene syntactic foam with microballoons

    Wang, E. & Omiya, M., 2011, Materials Science and Engineering Applications. p. 1280-1284 5 p. (Advanced Materials Research; vol. 160-162).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • A study on properties of ionic polymer metal composite

    Kobayashi, T. & Omiya, M., 2011, Smart Materials and Intelligent Systems. p. 394-398 5 p. (Advanced Materials Research; vol. 143-144).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    4 Citations (Scopus)
  • Empirical equations for a study on strain rate sensitivity of polypropylene syntactic foam

    Wang, E. & Omiya, M., 2011, Smart Materials and Intelligent Systems. p. 303-307 5 p. (Advanced Materials Research; vol. 143-144).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Frequency response of IPMC actuator with palladium electrode

    Kobayashi, T. & Omiya, M., 2011 May 17, Electroactive Polymer Actuators and Devices (EAPAD) 2011. 797614. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 7976).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    2 Citations (Scopus)
  • Interface toughness evaluation with specimens fabricated by focused ion beam for micro scale devices and packages

    Shishido, N., Matsumoto, S., Chen, C., Sato, H., Omiya, M., Kamiya, S., Nishida, M., Nokuo, T., Nagasawa, T., Suzuki, T. & Nakamura, T., 2011 Dec 1, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; vol. 1).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Ionic polymer metal composite (IPMC) for MEMS actuator and sensor

    Yanamori, H., Kobayashi, T. & Omiya, M., 2011 Dec 1, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. p. 417-424 8 p. (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; vol. 1).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)
  • 2010

    Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects

    Kamiya, S., Sato, H., Nishida, M., Chen, C., Shishido, N., Omiya, M., Suzuki, T., Nakamura, T., Nokuo, T. & Nagasawa, T., 2010 Dec 1, Stress-Induced Phenomena in Metallization - Eleventh International Workshop on Stress-Induced Phenomena in Metallization. p. 33-38 6 p. (AIP Conference Proceedings; vol. 1300).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    6 Citations (Scopus)
  • 2009

    Fabrication of ionic polymer metal composite actuator with palladium electrodes and evaluation of its bending response

    Kobayashi, T., Kuribayashi, T. & Omiya, M., 2009, Active Polymers. Materials Research Society, p. 181-186 6 p. (Materials Research Society Symposium Proceedings; vol. 1190).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Photoluminescence of cubic and monoclinic Gd 2o 3:Eu phosphors prepared by spray flame synthesis

    Iwako, Y., Akimoto, Y., Omiya, M., Ueda, T. & Yokomori, T., 2009 Dec 1, Advances and Trends in Engineering Materials and their Applications - Proceedings of AES-ATEMA'2009 4th International Conference. p. 161-166 6 p. (AES-ATEMA International Conference Series - Advances and Trends in Engineering Materials and their Applications).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)
  • 2008

    Evaluation and characterization of plastics-made sheet type components under impact

    Machmud, M. N., Omiya, M., Inoue, H. & Kishimoto, K., 2008, Advances in Fracture and Materials Behavior - Selected, peer reviewed papers of the Seventh International Conference on Fracture and Strength of Solids (FEOFS2007). Trans Tech Publications, p. 381-386 6 p. (Advanced Materials Research; vol. 33-37 PART 1).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Fracture of conductive ceramic thin film on polymer substrate in opto-electric devices

    Omiya, M., 2008 Dec 1, 17th European Conference on Fracture 2008: Multilevel Approach to Fracture of Materials, Components and Structures. p. 1778-1783 6 p. (17th European Conference on Fracture 2008: Multilevel Approach to Fracture of Materials, Components and Structures; vol. 3).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)
  • Mechanical behavior of UV irradiated glass fiber reinforced composite material

    Hayabusa, K., Kudo, D., Ohtani, T., Omiya, M., Inoue, H. & Kishimoto, K., 2008 Dec 1, Progress of Composites 2008 in Asia and Australasia - Proceedings of the 6th Asian-Australasian Conference on Composite Materials, ACCM 2008. p. 157-159 3 p. (Progress of Composites 2008 in Asia and Australasia - Proceedings of the 6th Asian-Australasian Conference on Composite Materials, ACCM 2008).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Toughening mechanism of PP with bimodal distributed SEBS particle size

    Mae, H., Omiya, M. & Kishimoto, K., 2008 Dec 22, Society for Experimental Mechanics - 11th International Congress and Exhibition on Experimental and Applied Mechanics 2008. p. 233-239 7 p. (Society for Experimental Mechanics - 11th International Congress and Exhibition on Experimental and Applied Mechanics 2008; vol. 1).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    3 Citations (Scopus)
  • 2007

    A trial for micro-scale evaluation of adhesion strength around Cu metallization systems

    Kamiya, S., Arakawa, H., Shimomura, H. & Omiya, M., 2007 Jan 1, Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics. Materials Research Society, p. 213-218 6 p. (Materials Research Society Symposium Proceedings; vol. 990).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Dynamic mechanical properties of polypropylene syntactic foam with polymer microballoons

    Mae, H., Omiya, M. & Kishimoto, K., 2007, Advances in Experimental Mechanics V - 5th International Conference on Advances in Experimental Mechanics. Trans Tech Publications Ltd, p. 289-294 6 p. (Applied Mechanics and Materials; vol. 7-8).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Study on fatigue strength characteristics for solder joints

    Kaneko, D., Inoue, H., Kishimoto, K., Omiya, M. & Amagai, M., 2007 Dec 1, EMAP 2007- International Conference on Electronic Materials and Packaging 2007. 4510302. (EMAP 2007 - International Conference on Electronic Materials and Packaging 2007).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 2006

    Effect of Ni plating thickness on fatigue failure of lead-free solder joints

    Omiya, M., Miyazaki, T., Inoue, H., Kishimoto, K. & Amagai, M., 2006 Dec 1, 2006 International Conference on Electronic Materials and Packaging, EMAP. 4430655. (2006 International Conference on Electronic Materials and Packaging, EMAP).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Interfacial strength of ceramic thin film on polymer substrate

    Omiya, M. & Kishimoto, K., 2006 Jan 1, Fracture of Nano and Engineering Materials and Structures - Proceedings of the 16th European Conference of Fracture. Gdoutos, E. E. (ed.). Kluwer Academic Publishers, p. 83-84 2 p. (Fracture of Nano and Engineering Materials and Structures - Proceedings of the 16th European Conference of Fracture).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Rubber particle size effect on impact characteristics of PC/ ABS (50/50) blends

    Machmud, M. N., Omiya, M., Inoue, H. & Kishimoto, K., 2006 Jan 1, Fracture of Nano and Engineering Materials and Structures - Proceedings of the 16th European Conference of Fracture. Gdoutos, E. E. (ed.). Kluwer Academic Publishers, p. 505-506 2 p. (Fracture of Nano and Engineering Materials and Structures - Proceedings of the 16th European Conference of Fracture).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    5 Citations (Scopus)
  • 2005

    Evaluation of fatigue strength for solder joints after thermal aging

    Miyazaki, T., Oomiya, M., Inoue, H., Kishimoto, K. & Amagai, M., 2005 Dec 1, Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging. p. 215-219 5 p. 1598264. (Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging; vol. 2005).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)
  • Fatigue crack growth in lead-free solder joints

    Omiya, M., Kishimoto, K. & Amagai, M., 2005 Dec 1, Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging. p. 232-237 6 p. 1598267. (Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging; vol. 2005).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 2002

    Measurement of copper thin film adhesion by multi-stages peel test

    Omiya, M., Kishimoto, K., Inoue, H. & Amagai, M., 2002, Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., p. 472-477 6 p. 1188885. (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    6 Citations (Scopus)
  • 2001

    A mechanical reliability assessment of solder joints

    Kishimoto, K., Omiya, M. & Amagai, M., 2001, Advances in Electronic Materials and Packaging 2001. Institute of Electrical and Electronics Engineers Inc., p. 8-14 7 p. 983948

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    5 Citations (Scopus)
  • Effect of intermetallic compound layer development on interfacial strength of solder joints

    Omiya, M., Kishimoto, K., Shibuya, T. & Amagai, M., 2001 Dec 1, Advances in Electronic Packaging; Thermal Manegement Reliability. p. 1157-1164 8 p. (Advances in Electronic Packaging; vol. 2).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)