1.27Gb/s/pin 3mW/pin wireless superconnect (WSC) interface scheme

Kouichi Kanda, Danardono Dwi Antono, Koichi Ishida, Hiroshi Kawaguchi, Tadahiro Kuroda, Takayasu Sakurai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

100 Citations (Scopus)

Abstract

A low-power high-speed chip-to-chip interface scheme is described having a density of 625pins/mm2. The interface utilizes capacitively coupled contactless minipads, return-to-half-VDD signaling and sense amplifying F/F. The measured test chip fabricated in 0.35μm CMOS delivers up to 1.27Gb/s/pin at 3mW/pin.

Original languageEnglish
Title of host publicationDigest of Technical Papers - IEEE International Solid-State Circuits Conference
EditorsL.C. Fujino, A. Grabel, D. Jeager, K.C. Smith
Publication statusPublished - 2003
Event2003 Digest of Technical Papers - , United States
Duration: 2003 Feb 92003 Feb 13

Other

Other2003 Digest of Technical Papers
CountryUnited States
Period03/2/903/2/13

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Hardware and Architecture

Cite this

Kanda, K., Dwi Antono, D., Ishida, K., Kawaguchi, H., Kuroda, T., & Sakurai, T. (2003). 1.27Gb/s/pin 3mW/pin wireless superconnect (WSC) interface scheme. In L. C. Fujino, A. Grabel, D. Jeager, & K. C. Smith (Eds.), Digest of Technical Papers - IEEE International Solid-State Circuits Conference

1.27Gb/s/pin 3mW/pin wireless superconnect (WSC) interface scheme. / Kanda, Kouichi; Dwi Antono, Danardono; Ishida, Koichi; Kawaguchi, Hiroshi; Kuroda, Tadahiro; Sakurai, Takayasu.

Digest of Technical Papers - IEEE International Solid-State Circuits Conference. ed. / L.C. Fujino; A. Grabel; D. Jeager; K.C. Smith. 2003.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kanda, K, Dwi Antono, D, Ishida, K, Kawaguchi, H, Kuroda, T & Sakurai, T 2003, 1.27Gb/s/pin 3mW/pin wireless superconnect (WSC) interface scheme. in LC Fujino, A Grabel, D Jeager & KC Smith (eds), Digest of Technical Papers - IEEE International Solid-State Circuits Conference. 2003 Digest of Technical Papers, United States, 03/2/9.
Kanda K, Dwi Antono D, Ishida K, Kawaguchi H, Kuroda T, Sakurai T. 1.27Gb/s/pin 3mW/pin wireless superconnect (WSC) interface scheme. In Fujino LC, Grabel A, Jeager D, Smith KC, editors, Digest of Technical Papers - IEEE International Solid-State Circuits Conference. 2003
Kanda, Kouichi ; Dwi Antono, Danardono ; Ishida, Koichi ; Kawaguchi, Hiroshi ; Kuroda, Tadahiro ; Sakurai, Takayasu. / 1.27Gb/s/pin 3mW/pin wireless superconnect (WSC) interface scheme. Digest of Technical Papers - IEEE International Solid-State Circuits Conference. editor / L.C. Fujino ; A. Grabel ; D. Jeager ; K.C. Smith. 2003.
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