1.27Gb/s/pin 3mW/pin wireless superconnect (WSC) interface scheme

Kouichi Kanda; Danardono Dwi Antono; Koichi Ishida; Hiroshi Kawaguchi; Tadahiro Kuroda; Takayasu Sakurai

1.27Gb/s/pin 3mW/pin wireless superconnect (WSC) interface scheme

Kouichi Kanda, Danardono Dwi Antono, Koichi Ishida, Hiroshi Kawaguchi, Tadahiro Kuroda, Takayasu Sakurai

Department of Electronics and Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

100 Citations (Scopus)

Abstract

A low-power high-speed chip-to-chip interface scheme is described having a density of 625pins/mm². The interface utilizes capacitively coupled contactless minipads, return-to-half-V_DD signaling and sense amplifying F/F. The measured test chip fabricated in 0.35μm CMOS delivers up to 1.27Gb/s/pin at 3mW/pin.

Original language	English
Title of host publication	Digest of Technical Papers - IEEE International Solid-State Circuits Conference
Editors	L.C. Fujino, A. Grabel, D. Jeager, K.C. Smith
Publication status	Published - 2003
Event	2003 Digest of Technical Papers - , United States Duration: 2003 Feb 9 → 2003 Feb 13

Other

Other	2003 Digest of Technical Papers
Country	United States
Period	03/2/9 → 03/2/13

ASJC Scopus subject areas

Electrical and Electronic Engineering
Hardware and Architecture

Cite this

Kanda, K., Dwi Antono, D., Ishida, K., Kawaguchi, H., Kuroda, T., & Sakurai, T. (2003). 1.27Gb/s/pin 3mW/pin wireless superconnect (WSC) interface scheme. In L. C. Fujino, A. Grabel, D. Jeager, & K. C. Smith (Eds.), Digest of Technical Papers - IEEE International Solid-State Circuits Conference

1.27Gb/s/pin 3mW/pin wireless superconnect (WSC) interface scheme. / Kanda, Kouichi; Dwi Antono, Danardono; Ishida, Koichi; Kawaguchi, Hiroshi; Kuroda, Tadahiro; Sakurai, Takayasu.

Digest of Technical Papers - IEEE International Solid-State Circuits Conference. ed. / L.C. Fujino; A. Grabel; D. Jeager; K.C. Smith. 2003.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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1.27Gb/s/pin 3mW/pin wireless superconnect (WSC) interface scheme

Abstract

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ASJC Scopus subject areas

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