TY - GEN
T1 - 1W 3.3V-to-16.3V boosting wireless power transfer circuits with vector summing power controller
AU - Tomita, Kazutoshi
AU - Shinoda, Ryota
AU - Kuroda, Tadahiro
AU - Ishikuro, Hiroki
PY - 2011/12/1
Y1 - 2011/12/1
N2 - This paper presents SD card size wireless power transfer system for large volume contactless memory cards. Voltage is boosted simultaneously with power transfer, which eliminates the DC-DC converter or charge-pump circuit for data write operation into the flash memory chip. The proposed approach reduces the number of components and BOM cost and improve the total power efficiency. Vector summing technique is proposed to control the transmitting power and secondary side voltage. The transmitter and rectifier have been designed and fabricated using 0.18um-CMOS with high voltage option. Voltage boost from 3.3V to 16.3V and 1W power transfer with 50% total efficiency have been successfully demonstrated.
AB - This paper presents SD card size wireless power transfer system for large volume contactless memory cards. Voltage is boosted simultaneously with power transfer, which eliminates the DC-DC converter or charge-pump circuit for data write operation into the flash memory chip. The proposed approach reduces the number of components and BOM cost and improve the total power efficiency. Vector summing technique is proposed to control the transmitting power and secondary side voltage. The transmitter and rectifier have been designed and fabricated using 0.18um-CMOS with high voltage option. Voltage boost from 3.3V to 16.3V and 1W power transfer with 50% total efficiency have been successfully demonstrated.
UR - http://www.scopus.com/inward/record.url?scp=84856351890&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84856351890&partnerID=8YFLogxK
U2 - 10.1109/ASSCC.2011.6123631
DO - 10.1109/ASSCC.2011.6123631
M3 - Conference contribution
AN - SCOPUS:84856351890
SN - 9781467303989
T3 - 2011 Proceedings of Technical Papers: IEEE Asian Solid-State Circuits Conference 2011, A-SSCC 2011
SP - 177
EP - 180
BT - 2011 Proceedings of Technical Papers
T2 - 7th IEEE Asian Solid-State Circuits Conference, A-SSCC 2011
Y2 - 14 November 2011 through 16 November 2011
ER -