320 Gb/s high-speed ATM switching system hardware technologies based on copper-polyimide MCM

Naoaki Yamanaka, Ken ichi Endo, Kouichi Genda, Hideki Fukuda, Tohru Kishimoto, Shin ichi Sasaki

Research output: Contribution to journalArticle

24 Citations (Scopus)

Abstract

This paper describes a 320 Gb/s high-speed multichip ATM switching system for broadband ISDN. This system employs a copper-polyimide MCM with 4-layer copper-polyimide signal transmission layers and 15-layer ceramic power supply layers. The system uses 64 MCM's that are interconnected by 98-highway flexible printed circuit connector. Si-bipolar VLSI's are mounted on MCM's using the 150 μm very-thin pitch outer lead TAB technique. In addition, a high-performance heat-pipe air cooling technique is adopted. The system switches ATM cells up to 320 Gb/s throughput, which is applicable for future B-ISDN.

Original languageEnglish
Pages (from-to)83-91
Number of pages9
JournalIEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging
Volume18
Issue number1
DOIs
Publication statusPublished - 1995 Feb
Externally publishedYes

Fingerprint

Switching systems
Automatic teller machines
Multicarrier modulation
Polyimides
Computer hardware
Copper
Printed circuits
Voice/data communication systems
Heat pipes
Lead
Switches
Throughput
Cooling
Air

ASJC Scopus subject areas

  • Engineering(all)

Cite this

320 Gb/s high-speed ATM switching system hardware technologies based on copper-polyimide MCM. / Yamanaka, Naoaki; Endo, Ken ichi; Genda, Kouichi; Fukuda, Hideki; Kishimoto, Tohru; Sasaki, Shin ichi.

In: IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, Vol. 18, No. 1, 02.1995, p. 83-91.

Research output: Contribution to journalArticle

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