3D image analysis for evaluating internal deformation / fracture characteristics of materials

Mitsuru Nakazawa, Yoshimitsu Aoki, Yuji Kawai, Masakazu Kobayashi, Hiroyuki Toda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In order to understand deformation / fracture characteristics, many measurement methods have been proposed and developed. Almost all methods, however, have been limited on the surface indirectly due to insufficient resolution. Recently, third-generation synchrotron radiation facilities have enabled observations with high resolution. Therefore, the 3D mapping of structural features like air bubbles (pores) have been attempted to understand local deformation / fracture characteristics in some materials using the X-ray computed tomography (CT). However, there are some issues and one of them is long processing time. In this paper, we propose a system which can measure a 3D, local, high-accuracy deformation / fracture characteristic by obtaining the strain distribution. Experiments have proved its effectiveness.

Original languageEnglish
Title of host publicationIECON 2006 - 32nd Annual Conference on IEEE Industrial Electronics
Pages3525-3530
Number of pages6
DOIs
Publication statusPublished - 2006 Dec 1
Externally publishedYes
EventIECON 2006 - 32nd Annual Conference on IEEE Industrial Electronics - Paris, France
Duration: 2006 Nov 62006 Nov 10

Publication series

NameIECON Proceedings (Industrial Electronics Conference)

Other

OtherIECON 2006 - 32nd Annual Conference on IEEE Industrial Electronics
CountryFrance
CityParis
Period06/11/606/11/10

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ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Nakazawa, M., Aoki, Y., Kawai, Y., Kobayashi, M., & Toda, H. (2006). 3D image analysis for evaluating internal deformation / fracture characteristics of materials. In IECON 2006 - 32nd Annual Conference on IEEE Industrial Electronics (pp. 3525-3530). [4153571] (IECON Proceedings (Industrial Electronics Conference)). https://doi.org/10.1109/IECON.2006.347950