TY - GEN
T1 - 3D image analysis for evaluating internal deformation/fracture characteristics of materials
AU - Nakazawa, Mitsuru
AU - Aoki, Yoshimitsu
AU - Kobayashi, Masakazu
AU - Toda, Hiroyuki
PY - 2008
Y1 - 2008
N2 - In the past, D/F characteristics, load-deformation relationships until the materials are fractured, have been analyzed on the suiface. The D/F characteristics are affected by more than ten thousand micro-scale internal structures like air bubbles (pores), cracks and particles; therefore, it is required to analyze nano-scale D/F characteristics inside materials. In this paper, we propose a method that automatically obtains the corresponding relations ofthe particles from nano-order 3D-CT images at each deformation stage. The particles are deformation-proof and may have different geometries. First of all, some big particles are considered as landmarks and matched between pre- and post-deformation. The results oflandmark matching make it easy to match many remaining particles and pores.
AB - In the past, D/F characteristics, load-deformation relationships until the materials are fractured, have been analyzed on the suiface. The D/F characteristics are affected by more than ten thousand micro-scale internal structures like air bubbles (pores), cracks and particles; therefore, it is required to analyze nano-scale D/F characteristics inside materials. In this paper, we propose a method that automatically obtains the corresponding relations ofthe particles from nano-order 3D-CT images at each deformation stage. The particles are deformation-proof and may have different geometries. First of all, some big particles are considered as landmarks and matched between pre- and post-deformation. The results oflandmark matching make it easy to match many remaining particles and pores.
UR - http://www.scopus.com/inward/record.url?scp=77957934481&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77957934481&partnerID=8YFLogxK
U2 - 10.1109/icpr.2008.4761648
DO - 10.1109/icpr.2008.4761648
M3 - Conference contribution
AN - SCOPUS:77957934481
SN - 9781424421756
T3 - Proceedings - International Conference on Pattern Recognition
BT - 2008 19th International Conference on Pattern Recognition, ICPR 2008
PB - Institute of Electrical and Electronics Engineers Inc.
ER -