3D integration of heterogeneous MEMS structures by stamping transfer

Hiroaki Onoe; Eiji Iwase; Kiyoshi Matsumoto; Isao Shimoyama

3D integration of heterogeneous MEMS structures by stamping transfer

Hiroaki Onoe, Eiji Iwase, Kiyoshi Matsumoto, Isao Shimoyama

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

We propose an integration method of heterogeneous micro-electro-mechanical- system (MEMS) structures by liftoff and stamping transfer using a poly-(dimethylsiloxane) (PDMS) sheet. Silicon structures fabricated on multiple wafers were lifted off by PDMS sheets, and integrated onto a single wafer by the stamping transfer with high yield (>90 %) and high accuracy (position error <500 nm). A two-dimensional (2D) integration and three-dimensional (3D) assembly of pyramid-like/inverted pyramid-like structures were demonstrated by our method. These demonstrations prove that our method enables us to integrate process-incompatible heterogeneous MEMS structures onto a single wafer.

Original language	English
Title of host publication	Proceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007
Pages	175-178
Number of pages	4
Publication status	Published - 2007 Dec 1
Externally published	Yes
Event	20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007 - Kobe, Japan Duration: 2007 Jan 21 → 2007 Jan 25

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)	1084-6999

Other

Other	20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007
Country/Territory	Japan
City	Kobe
Period	07/1/21 → 07/1/25

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Mechanical Engineering
Electrical and Electronic Engineering

Cite this

Onoe, H., Iwase, E., Matsumoto, K., & Shimoyama, I. (2007). 3D integration of heterogeneous MEMS structures by stamping transfer. In Proceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007 (pp. 175-178). [4433045] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

3D integration of heterogeneous MEMS structures by stamping transfer. / Onoe, Hiroaki; Iwase, Eiji; Matsumoto, Kiyoshi et al.
Proceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007. 2007. p. 175-178 4433045 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Onoe, H, Iwase, E, Matsumoto, K & Shimoyama, I 2007, 3D integration of heterogeneous MEMS structures by stamping transfer. in Proceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007., 4433045, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), pp. 175-178, 20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007, Kobe, Japan, 07/1/21.

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AB - We propose an integration method of heterogeneous micro-electro-mechanical- system (MEMS) structures by liftoff and stamping transfer using a poly-(dimethylsiloxane) (PDMS) sheet. Silicon structures fabricated on multiple wafers were lifted off by PDMS sheets, and integrated onto a single wafer by the stamping transfer with high yield (>90 %) and high accuracy (position error <500 nm). A two-dimensional (2D) integration and three-dimensional (3D) assembly of pyramid-like/inverted pyramid-like structures were demonstrated by our method. These demonstrations prove that our method enables us to integrate process-incompatible heterogeneous MEMS structures onto a single wafer.

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3D integration of heterogeneous MEMS structures by stamping transfer

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ASJC Scopus subject areas

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