3D integration using inductive coupling and coupled resonator (Invited)

Yasuhiro Take, Junichiro Kadomoto, Tadahiro Kuroda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    This paper describes a wireless inter-chip link using inductive coupling, namely ThruChip Interface (TCI) and a low-skew 3D clock distribution network using coupled resonator. Applying a TCI and a coupled resonator make it possible to integrate chips three dimensionally by applying conventional CMOS technology without new additional processing. Although the additional cost of a TCI is much lower than that of a through-silicon via (TSV), speed, power, reliability, and testability are not compromised.

    Original languageEnglish
    Title of host publication2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages46-48
    Number of pages3
    ISBN (Print)9781467377942
    DOIs
    Publication statusPublished - 2016 Jan 8
    EventIEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Sendai, Japan
    Duration: 2015 Aug 262015 Aug 28

    Other

    OtherIEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015
    CountryJapan
    CitySendai
    Period15/8/2615/8/28

    Keywords

    • 3D IC
    • 3D integration
    • Coupled resonator
    • Inductive coupling

    ASJC Scopus subject areas

    • Computer Networks and Communications
    • Electrical and Electronic Engineering

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  • Cite this

    Take, Y., Kadomoto, J., & Kuroda, T. (2016). 3D integration using inductive coupling and coupled resonator (Invited). In 2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings (pp. 46-48). [7377882] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/RFIT.2015.7377882