Abstract
This paper describes a wireless inter-chip link using inductive coupling, namely ThruChip Interface (TCI) and a low-skew 3D clock distribution network using coupled resonator. Applying a TCI and a coupled resonator make it possible to integrate chips three dimensionally by applying conventional CMOS technology without new additional processing. Although the additional cost of a TCI is much lower than that of a through-silicon via (TSV), speed, power, reliability, and testability are not compromised.
| Original language | English |
|---|---|
| Title of host publication | 2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 46-48 |
| Number of pages | 3 |
| ISBN (Print) | 9781467377942 |
| DOIs | |
| Publication status | Published - 2016 Jan 8 |
| Event | IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Sendai, Japan Duration: 2015 Aug 26 → 2015 Aug 28 |
Other
| Other | IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 |
|---|---|
| Country | Japan |
| City | Sendai |
| Period | 15/8/26 → 15/8/28 |
Keywords
- 3D IC
- 3D integration
- Coupled resonator
- Inductive coupling
ASJC Scopus subject areas
- Computer Networks and Communications
- Electrical and Electronic Engineering
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Cite this
Take, Y., Kadomoto, J., & Kuroda, T. (2016). 3D integration using inductive coupling and coupled resonator (Invited). In 2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings (pp. 46-48). [7377882] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/RFIT.2015.7377882