3D integration using inductive coupling and coupled resonator (Invited)

Yasuhiro Take; Junichiro Kadomoto; Tadahiro Kuroda

doi:10.1109/RFIT.2015.7377882

3D integration using inductive coupling and coupled resonator (Invited)

Yasuhiro Take, Junichiro Kadomoto, Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This paper describes a wireless inter-chip link using inductive coupling, namely ThruChip Interface (TCI) and a low-skew 3D clock distribution network using coupled resonator. Applying a TCI and a coupled resonator make it possible to integrate chips three dimensionally by applying conventional CMOS technology without new additional processing. Although the additional cost of a TCI is much lower than that of a through-silicon via (TSV), speed, power, reliability, and testability are not compromised.

Original language	English
Title of host publication	2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	46-48
Number of pages	3
ISBN (Print)	9781467377942
DOIs	https://doi.org/10.1109/RFIT.2015.7377882
Publication status	Published - 2016 Jan 8
Event	IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Sendai, Japan Duration: 2015 Aug 26 → 2015 Aug 28

Other

Other	IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015
Country/Territory	Japan
City	Sendai
Period	15/8/26 → 15/8/28

Keywords

3D IC
3D integration
Coupled resonator
Inductive coupling

ASJC Scopus subject areas

Computer Networks and Communications
Electrical and Electronic Engineering

Access to Document

10.1109/RFIT.2015.7377882

Cite this

3D integration using inductive coupling and coupled resonator (Invited). / Take, Yasuhiro; Kadomoto, Junichiro; Kuroda, Tadahiro.

2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2016. p. 46-48 7377882.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Take, Y, Kadomoto, J & Kuroda, T 2016, 3D integration using inductive coupling and coupled resonator (Invited). in 2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings., 7377882, Institute of Electrical and Electronics Engineers Inc., pp. 46-48, IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015, Sendai, Japan, 15/8/26. https://doi.org/10.1109/RFIT.2015.7377882

@inproceedings{e76c067b7cab49859f795fd4c0509385,

title = "3D integration using inductive coupling and coupled resonator (Invited)",

abstract = "This paper describes a wireless inter-chip link using inductive coupling, namely ThruChip Interface (TCI) and a low-skew 3D clock distribution network using coupled resonator. Applying a TCI and a coupled resonator make it possible to integrate chips three dimensionally by applying conventional CMOS technology without new additional processing. Although the additional cost of a TCI is much lower than that of a through-silicon via (TSV), speed, power, reliability, and testability are not compromised.",

keywords = "3D IC, 3D integration, Coupled resonator, Inductive coupling",

author = "Yasuhiro Take and Junichiro Kadomoto and Tadahiro Kuroda",

year = "2016",

month = jan,

day = "8",

doi = "10.1109/RFIT.2015.7377882",

language = "English",

isbn = "9781467377942",

pages = "46--48",

booktitle = "2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 ; Conference date: 26-08-2015 Through 28-08-2015",

}

TY - GEN

T1 - 3D integration using inductive coupling and coupled resonator (Invited)

AU - Take, Yasuhiro

AU - Kadomoto, Junichiro

AU - Kuroda, Tadahiro

PY - 2016/1/8

Y1 - 2016/1/8

N2 - This paper describes a wireless inter-chip link using inductive coupling, namely ThruChip Interface (TCI) and a low-skew 3D clock distribution network using coupled resonator. Applying a TCI and a coupled resonator make it possible to integrate chips three dimensionally by applying conventional CMOS technology without new additional processing. Although the additional cost of a TCI is much lower than that of a through-silicon via (TSV), speed, power, reliability, and testability are not compromised.

AB - This paper describes a wireless inter-chip link using inductive coupling, namely ThruChip Interface (TCI) and a low-skew 3D clock distribution network using coupled resonator. Applying a TCI and a coupled resonator make it possible to integrate chips three dimensionally by applying conventional CMOS technology without new additional processing. Although the additional cost of a TCI is much lower than that of a through-silicon via (TSV), speed, power, reliability, and testability are not compromised.

KW - 3D IC

KW - 3D integration

KW - Coupled resonator

KW - Inductive coupling

UR - http://www.scopus.com/inward/record.url?scp=84962885856&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84962885856&partnerID=8YFLogxK

U2 - 10.1109/RFIT.2015.7377882

DO - 10.1109/RFIT.2015.7377882

M3 - Conference contribution

AN - SCOPUS:84962885856

SN - 9781467377942

SP - 46

EP - 48

BT - 2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015

Y2 - 26 August 2015 through 28 August 2015

ER -

3D integration using inductive coupling and coupled resonator (Invited)

Abstract

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Keywords

ASJC Scopus subject areas

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