3D integration using inductive coupling and coupled resonator (Invited)

Yasuhiro Take, Junichiro Kadomoto, Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper describes a wireless inter-chip link using inductive coupling, namely ThruChip Interface (TCI) and a low-skew 3D clock distribution network using coupled resonator. Applying a TCI and a coupled resonator make it possible to integrate chips three dimensionally by applying conventional CMOS technology without new additional processing. Although the additional cost of a TCI is much lower than that of a through-silicon via (TSV), speed, power, reliability, and testability are not compromised.

Original languageEnglish
Title of host publication2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages46-48
Number of pages3
ISBN (Print)9781467377942
DOIs
Publication statusPublished - 2016 Jan 8
EventIEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Sendai, Japan
Duration: 2015 Aug 262015 Aug 28

Other

OtherIEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015
CountryJapan
CitySendai
Period15/8/2615/8/28

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Keywords

  • 3D IC
  • 3D integration
  • Coupled resonator
  • Inductive coupling

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Electrical and Electronic Engineering

Cite this

Take, Y., Kadomoto, J., & Kuroda, T. (2016). 3D integration using inductive coupling and coupled resonator (Invited). In 2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings (pp. 46-48). [7377882] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/RFIT.2015.7377882