Abstract
This paper describes a wireless inter-chip link using inductive coupling, namely ThruChip Interface (TCI) and a low-skew 3D clock distribution network using coupled resonator. Applying a TCI and a coupled resonator make it possible to integrate chips three dimensionally by applying conventional CMOS technology without new additional processing. Although the additional cost of a TCI is much lower than that of a through-silicon via (TSV), speed, power, reliability, and testability are not compromised.
Original language | English |
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Title of host publication | 2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 46-48 |
Number of pages | 3 |
ISBN (Print) | 9781467377942 |
DOIs | |
Publication status | Published - 2016 Jan 8 |
Event | IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Sendai, Japan Duration: 2015 Aug 26 → 2015 Aug 28 |
Other
Other | IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 |
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Country | Japan |
City | Sendai |
Period | 15/8/26 → 15/8/28 |
Keywords
- 3D IC
- 3D integration
- Coupled resonator
- Inductive coupling
ASJC Scopus subject areas
- Computer Networks and Communications
- Electrical and Electronic Engineering