3D jisso technology opened-up by near-field wireless communications

Tadahiro Kuroda

    Research output: Contribution to journalArticle

    Original languageEnglish
    Pages (from-to)231-235
    Number of pages5
    JournalJournal of Japan Institute of Electronics Packaging
    Volume15
    Issue number4
    DOIs
    Publication statusPublished - 2012 Jul

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

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