3D stacked imager featuring inductive coupling channels for high speed/low-noise image transfer

Masayuki Ikebe; Daisuke Uchida; Yasuhiro Take; Makito Someya; Satoshi Chikuda; Kento Matsuyama; Tetsuya Asai; Tadahiro Kuroda; Masato Motomura

doi:10.3169/mta.4.142

3D stacked imager featuring inductive coupling channels for high speed/low-noise image transfer

Masayuki Ikebe, Daisuke Uchida, Yasuhiro Take, Makito Someya, Satoshi Chikuda, Kento Matsuyama, Tetsuya Asai, Tadahiro Kuroda, Masato Motomura

Research output: Contribution to journal › Article › peer-review

Abstract

This paper proposes 3D stacked module consisting of image sensor and digital logic dies connected through inductive coupling channels. Evaluation of a prototype module revealed radiation noise from the inductive coils to the image sensor is less than 0.4-LSB range along with ADC code, i.e., negligible. Aiming at high frame rate image sensor/processing module exploiting this attractive off-die interface, we also worked on resolving another throughput-limiter, namely power consuming Time to Digital Converter (TDC) used in column parallel ADCs. Novel intermittent TDC operation scheme presented in this paper can reduce its power dissipation 57% from conventional ones.

Original language	English
Pages (from-to)	142-148
Number of pages	7
Journal	ITE Transactions on Media Technology and Applications
Volume	4
Issue number	2
DOIs	https://doi.org/10.3169/mta.4.142
Publication status	Published - 2016

Keywords

3D-stacked imager
Intermittent operation.
Radiation noise
Single-Slope ADC
Through Chip Interface (TCI)
Time to Digital Converter (TDC)

ASJC Scopus subject areas

Signal Processing
Media Technology
Computer Graphics and Computer-Aided Design

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10.3169/mta.4.142

Cite this

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abstract = "This paper proposes 3D stacked module consisting of image sensor and digital logic dies connected through inductive coupling channels. Evaluation of a prototype module revealed radiation noise from the inductive coils to the image sensor is less than 0.4-LSB range along with ADC code, i.e., negligible. Aiming at high frame rate image sensor/processing module exploiting this attractive off-die interface, we also worked on resolving another throughput-limiter, namely power consuming Time to Digital Converter (TDC) used in column parallel ADCs. Novel intermittent TDC operation scheme presented in this paper can reduce its power dissipation 57% from conventional ones.",

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AU - Ikebe, Masayuki

AU - Uchida, Daisuke

AU - Take, Yasuhiro

AU - Someya, Makito

AU - Chikuda, Satoshi

AU - Matsuyama, Kento

AU - Asai, Tetsuya

AU - Kuroda, Tadahiro

AU - Motomura, Masato

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3D stacked imager featuring inductive coupling channels for high speed/low-noise image transfer

Abstract

Keywords

ASJC Scopus subject areas

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