3D stacked imager featuring inductive coupling channels for high speed/low-noise image transfer

Masayuki Ikebe, Daisuke Uchida, Yasuhiro Take, Makito Someya, Satoshi Chikuda, Kento Matsuyama, Tetsuya Asai, Tadahiro Kuroda, Masato Motomura

    Research output: Contribution to journalArticle

    Abstract

    This paper proposes 3D stacked module consisting of image sensor and digital logic dies connected through inductive coupling channels. Evaluation of a prototype module revealed radiation noise from the inductive coils to the image sensor is less than 0.4-LSB range along with ADC code, i.e., negligible. Aiming at high frame rate image sensor/processing module exploiting this attractive off-die interface, we also worked on resolving another throughput-limiter, namely power consuming Time to Digital Converter (TDC) used in column parallel ADCs. Novel intermittent TDC operation scheme presented in this paper can reduce its power dissipation 57% from conventional ones.

    Original languageEnglish
    Pages (from-to)142-148
    Number of pages7
    JournalITE Transactions on Media Technology and Applications
    Volume4
    Issue number2
    Publication statusPublished - 2016

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    Keywords

    • 3D-stacked imager
    • Intermittent operation.
    • Radiation noise
    • Single-Slope ADC
    • Through Chip Interface (TCI)
    • Time to Digital Converter (TDC)

    ASJC Scopus subject areas

    • Computer Graphics and Computer-Aided Design
    • Signal Processing
    • Media Technology

    Cite this

    Ikebe, M., Uchida, D., Take, Y., Someya, M., Chikuda, S., Matsuyama, K., Asai, T., Kuroda, T., & Motomura, M. (2016). 3D stacked imager featuring inductive coupling channels for high speed/low-noise image transfer. ITE Transactions on Media Technology and Applications, 4(2), 142-148.