3D System Integration in a Package for Artificial Intelligence

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The connection problem of the early large-scale computers, the tyranny of numbers, was solved by the invention of the von Neumann computer, integrated circuit and solderless connection (Fig.1). However, the advance that has been achieved in all these technologies has made them the victim of their own success, with Moore's Law scaling and connector miniaturization each reaching its limits, and von Neumann bottleneck exacerbating. Furthermore, the adoption of neural network and deep learning for Artificial Intelligence (AI) has once again brought to the forefront the challenges of scale and wiring in building hardwired computers. The solutions can be found in near-field coupling integration technologies - ThruChip Interface (TCI) [1]- [26] and Transmission Line Coupler (TLC) [27]-[36]. TCI, a magnetic coupling technology, enables stacking DRAMs with an SoC to alleviate the von Neumann bottleneck. The same technology also enables stacking SRAMs with a neural network SoC to solve the challenges of scale and wiring in an AI computer. On the other hand, TLC, an electromagnetic coupling technology, enables a contactless connector that overcomes the scaling limits of its electro-mechanical counterpart.

Original languageEnglish
Title of host publication2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages80-81
Number of pages2
ISBN (Electronic)9781538665084
DOIs
Publication statusPublished - 2019 Mar 1
Event2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019 - Singapore, Singapore
Duration: 2019 Mar 122019 Mar 15

Publication series

Name2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019

Conference

Conference2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019
CountrySingapore
CitySingapore
Period19/3/1219/3/15

Fingerprint

artificial intelligence
systems integration
Artificial intelligence
systems-on-a-chip
wiring
connectors
couplers
transmission lines
Electric wiring
Electric lines
electromagnetic coupling
inventions
Neural networks
miniaturization
Electromagnetic coupling
Magnetic couplings
scaling laws
learning
Dynamic random access storage
Scaling laws

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Hardware and Architecture

Cite this

Kuroda, T. (2019). 3D System Integration in a Package for Artificial Intelligence. In 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019 (pp. 80-81). [8731232] (2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDTM.2019.8731232

3D System Integration in a Package for Artificial Intelligence. / Kuroda, Tadahiro.

2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 80-81 8731232 (2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kuroda, T 2019, 3D System Integration in a Package for Artificial Intelligence. in 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019., 8731232, 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019, Institute of Electrical and Electronics Engineers Inc., pp. 80-81, 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019, Singapore, Singapore, 19/3/12. https://doi.org/10.1109/EDTM.2019.8731232
Kuroda T. 3D System Integration in a Package for Artificial Intelligence. In 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 80-81. 8731232. (2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019). https://doi.org/10.1109/EDTM.2019.8731232
Kuroda, Tadahiro. / 3D System Integration in a Package for Artificial Intelligence. 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 80-81 (2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019).
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