3D System Integration in a Package for Artificial Intelligence

Tadahiro Kuroda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    The connection problem of the early large-scale computers, the tyranny of numbers, was solved by the invention of the von Neumann computer, integrated circuit and solderless connection (Fig.1). However, the advance that has been achieved in all these technologies has made them the victim of their own success, with Moore's Law scaling and connector miniaturization each reaching its limits, and von Neumann bottleneck exacerbating. Furthermore, the adoption of neural network and deep learning for Artificial Intelligence (AI) has once again brought to the forefront the challenges of scale and wiring in building hardwired computers. The solutions can be found in near-field coupling integration technologies - ThruChip Interface (TCI) [1]- [26] and Transmission Line Coupler (TLC) [27]-[36]. TCI, a magnetic coupling technology, enables stacking DRAMs with an SoC to alleviate the von Neumann bottleneck. The same technology also enables stacking SRAMs with a neural network SoC to solve the challenges of scale and wiring in an AI computer. On the other hand, TLC, an electromagnetic coupling technology, enables a contactless connector that overcomes the scaling limits of its electro-mechanical counterpart.

    Original languageEnglish
    Title of host publication2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages80-81
    Number of pages2
    ISBN (Electronic)9781538665084
    DOIs
    Publication statusPublished - 2019 Mar
    Event2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019 - Singapore, Singapore
    Duration: 2019 Mar 122019 Mar 15

    Publication series

    Name2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019

    Conference

    Conference2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019
    CountrySingapore
    CitySingapore
    Period19/3/1219/3/15

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Electronic, Optical and Magnetic Materials
    • Instrumentation
    • Hardware and Architecture

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  • Cite this

    Kuroda, T. (2019). 3D System Integration in a Package for Artificial Intelligence. In 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019 (pp. 80-81). [8731232] (2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDTM.2019.8731232