47% power reduction and 91% area reduction in inductive-coupling programmable bus for NAND flash memory stacking

Mitsuko Saito, Yasufumi Sugimori, Yoshinori Kohama, Yoichi Yoshida, Noriyuki Miura, Hiroki Ishikuro, Tadahiro Kuroda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    6 Citations (Scopus)

    Abstract

    An inductive-coupling programmable bus is developed for NAND flash memory access in Solid State Drive (SSD). A channel arrangement scheme using 3 coils enables random access for memory read and memory write. Transmission power is reduced by 47% compared to a previous design with 2 coils and a shield [1]. A coil layout style, namely XY coil, allows the coils covered by logic interconnections, resulting in area reduction by 91%. Relayed data transmission at 1.6Gb/s and BER<10-12 is achieved.

    Original languageEnglish
    Title of host publication2009 IEEE Custom Integrated Circuits Conference, CICC '09
    Pages449-452
    Number of pages4
    DOIs
    Publication statusPublished - 2009 Dec 1
    Event2009 IEEE Custom Integrated Circuits Conference, CICC '09 - San Jose, CA, United States
    Duration: 2009 Sep 132009 Sep 16

    Publication series

    NameProceedings of the Custom Integrated Circuits Conference
    ISSN (Print)0886-5930

    Other

    Other2009 IEEE Custom Integrated Circuits Conference, CICC '09
    CountryUnited States
    CitySan Jose, CA
    Period09/9/1309/9/16

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

    Fingerprint Dive into the research topics of '47% power reduction and 91% area reduction in inductive-coupling programmable bus for NAND flash memory stacking'. Together they form a unique fingerprint.

  • Cite this

    Saito, M., Sugimori, Y., Kohama, Y., Yoshida, Y., Miura, N., Ishikuro, H., & Kuroda, T. (2009). 47% power reduction and 91% area reduction in inductive-coupling programmable bus for NAND flash memory stacking. In 2009 IEEE Custom Integrated Circuits Conference, CICC '09 (pp. 449-452). [5280819] (Proceedings of the Custom Integrated Circuits Conference). https://doi.org/10.1109/CICC.2009.5280819