640-Gb/s high-speed ATM switching system based on 0.25-μm CMOS, MCM-C, and optical WDM interconnection

Naoaki Yamanaka, Ryusuke Kawano, Eiji Oki, Seisho Yasukawa, Katsuhiko Okazaki

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

A 640-Gb/s high-speed ATM switching system that is based on the technologies of advanced MCM-C, 0.25-μm CMOS, and optical wavelength-division-multiplexing (WDM) interconnection is fabricated for future broadband services. A 40-layer, 160 × 114 mm ceramic MCM forms the basic ATM switch module with 80-Gb/s throughput. It consists of an 8 advanced 0.25-μm CMOS LSIs and 32 I/O bipolar LSIs. The MCM has a 7-layer high-speed signal line structure having 50-Ω strip lines, high-speed signal lines, and 33 power supply layers formed using 50-μm very thin ceramic layers to achieve high capacity. A uniquely structured closed-loop-type liquid cooling system for the MCM is used to cope with its high-power dissipation of 230 W. A three-stage ATM switch is made using optical WDM interconnection between the high-performance MCMs. For WDM interconnection, newly developed compact 10-Gb/s, 8-WDM optical transmitter and receiver modules are used. These modules are each only 80 × 120 × 20 mm and they dissipate 9.65 W and 22.5 W, respectively. They have special chassis for cooling. The chassis contains high-performance heat-conductive plates and micro-fans. An optical WDM router based on an arrayed waveguide router is used for mesh interconnection of boards. The optical WDM interconnect has 640.Gb/s throughput and easy, simple interconnection. The system, MCM, and optical WDM interconnection will be applied to future broadband backbone networks.

Original languageEnglish
Pages (from-to)65-72
Number of pages8
JournalIEEE Transactions on Advanced Packaging
Volume25
Issue number1
DOIs
Publication statusPublished - 2002 Feb
Externally publishedYes

Fingerprint

Switching systems
Automatic teller machines
Multicarrier modulation
Wavelength division multiplexing
Chassis
Routers
Switches
Throughput
Strip telecommunication lines
Optical receivers
Broadband networks
Cooling systems
Printed circuit boards
Fans
Energy dissipation
Waveguides
Cooling
Liquids

Keywords

  • ATM
  • Cooling system
  • Multichip module
  • Switching system
  • WDM interconnection

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Materials Science(all)

Cite this

640-Gb/s high-speed ATM switching system based on 0.25-μm CMOS, MCM-C, and optical WDM interconnection. / Yamanaka, Naoaki; Kawano, Ryusuke; Oki, Eiji; Yasukawa, Seisho; Okazaki, Katsuhiko.

In: IEEE Transactions on Advanced Packaging, Vol. 25, No. 1, 02.2002, p. 65-72.

Research output: Contribution to journalArticle

Yamanaka, Naoaki ; Kawano, Ryusuke ; Oki, Eiji ; Yasukawa, Seisho ; Okazaki, Katsuhiko. / 640-Gb/s high-speed ATM switching system based on 0.25-μm CMOS, MCM-C, and optical WDM interconnection. In: IEEE Transactions on Advanced Packaging. 2002 ; Vol. 25, No. 1. pp. 65-72.
@article{6a0be9fbfd8b43b0b0036dae7677ff0a,
title = "640-Gb/s high-speed ATM switching system based on 0.25-μm CMOS, MCM-C, and optical WDM interconnection",
abstract = "A 640-Gb/s high-speed ATM switching system that is based on the technologies of advanced MCM-C, 0.25-μm CMOS, and optical wavelength-division-multiplexing (WDM) interconnection is fabricated for future broadband services. A 40-layer, 160 × 114 mm ceramic MCM forms the basic ATM switch module with 80-Gb/s throughput. It consists of an 8 advanced 0.25-μm CMOS LSIs and 32 I/O bipolar LSIs. The MCM has a 7-layer high-speed signal line structure having 50-Ω strip lines, high-speed signal lines, and 33 power supply layers formed using 50-μm very thin ceramic layers to achieve high capacity. A uniquely structured closed-loop-type liquid cooling system for the MCM is used to cope with its high-power dissipation of 230 W. A three-stage ATM switch is made using optical WDM interconnection between the high-performance MCMs. For WDM interconnection, newly developed compact 10-Gb/s, 8-WDM optical transmitter and receiver modules are used. These modules are each only 80 × 120 × 20 mm and they dissipate 9.65 W and 22.5 W, respectively. They have special chassis for cooling. The chassis contains high-performance heat-conductive plates and micro-fans. An optical WDM router based on an arrayed waveguide router is used for mesh interconnection of boards. The optical WDM interconnect has 640.Gb/s throughput and easy, simple interconnection. The system, MCM, and optical WDM interconnection will be applied to future broadband backbone networks.",
keywords = "ATM, Cooling system, Multichip module, Switching system, WDM interconnection",
author = "Naoaki Yamanaka and Ryusuke Kawano and Eiji Oki and Seisho Yasukawa and Katsuhiko Okazaki",
year = "2002",
month = "2",
doi = "10.1109/TADVP.2002.1017687",
language = "English",
volume = "25",
pages = "65--72",
journal = "IEEE Transactions on Advanced Packaging",
issn = "1521-3323",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "1",

}

TY - JOUR

T1 - 640-Gb/s high-speed ATM switching system based on 0.25-μm CMOS, MCM-C, and optical WDM interconnection

AU - Yamanaka, Naoaki

AU - Kawano, Ryusuke

AU - Oki, Eiji

AU - Yasukawa, Seisho

AU - Okazaki, Katsuhiko

PY - 2002/2

Y1 - 2002/2

N2 - A 640-Gb/s high-speed ATM switching system that is based on the technologies of advanced MCM-C, 0.25-μm CMOS, and optical wavelength-division-multiplexing (WDM) interconnection is fabricated for future broadband services. A 40-layer, 160 × 114 mm ceramic MCM forms the basic ATM switch module with 80-Gb/s throughput. It consists of an 8 advanced 0.25-μm CMOS LSIs and 32 I/O bipolar LSIs. The MCM has a 7-layer high-speed signal line structure having 50-Ω strip lines, high-speed signal lines, and 33 power supply layers formed using 50-μm very thin ceramic layers to achieve high capacity. A uniquely structured closed-loop-type liquid cooling system for the MCM is used to cope with its high-power dissipation of 230 W. A three-stage ATM switch is made using optical WDM interconnection between the high-performance MCMs. For WDM interconnection, newly developed compact 10-Gb/s, 8-WDM optical transmitter and receiver modules are used. These modules are each only 80 × 120 × 20 mm and they dissipate 9.65 W and 22.5 W, respectively. They have special chassis for cooling. The chassis contains high-performance heat-conductive plates and micro-fans. An optical WDM router based on an arrayed waveguide router is used for mesh interconnection of boards. The optical WDM interconnect has 640.Gb/s throughput and easy, simple interconnection. The system, MCM, and optical WDM interconnection will be applied to future broadband backbone networks.

AB - A 640-Gb/s high-speed ATM switching system that is based on the technologies of advanced MCM-C, 0.25-μm CMOS, and optical wavelength-division-multiplexing (WDM) interconnection is fabricated for future broadband services. A 40-layer, 160 × 114 mm ceramic MCM forms the basic ATM switch module with 80-Gb/s throughput. It consists of an 8 advanced 0.25-μm CMOS LSIs and 32 I/O bipolar LSIs. The MCM has a 7-layer high-speed signal line structure having 50-Ω strip lines, high-speed signal lines, and 33 power supply layers formed using 50-μm very thin ceramic layers to achieve high capacity. A uniquely structured closed-loop-type liquid cooling system for the MCM is used to cope with its high-power dissipation of 230 W. A three-stage ATM switch is made using optical WDM interconnection between the high-performance MCMs. For WDM interconnection, newly developed compact 10-Gb/s, 8-WDM optical transmitter and receiver modules are used. These modules are each only 80 × 120 × 20 mm and they dissipate 9.65 W and 22.5 W, respectively. They have special chassis for cooling. The chassis contains high-performance heat-conductive plates and micro-fans. An optical WDM router based on an arrayed waveguide router is used for mesh interconnection of boards. The optical WDM interconnect has 640.Gb/s throughput and easy, simple interconnection. The system, MCM, and optical WDM interconnection will be applied to future broadband backbone networks.

KW - ATM

KW - Cooling system

KW - Multichip module

KW - Switching system

KW - WDM interconnection

UR - http://www.scopus.com/inward/record.url?scp=0036478885&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0036478885&partnerID=8YFLogxK

U2 - 10.1109/TADVP.2002.1017687

DO - 10.1109/TADVP.2002.1017687

M3 - Article

AN - SCOPUS:0036478885

VL - 25

SP - 65

EP - 72

JO - IEEE Transactions on Advanced Packaging

JF - IEEE Transactions on Advanced Packaging

SN - 1521-3323

IS - 1

ER -