6W/25mm2 inductive power transfer for non-contact wafer-level testing

Andrzej Radecki, Hayun Chung, Yoichi Yoshida, Noriyuki Miura, Tsunaaki Shidei, Hiroki Ishikuro, Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

37 Citations (Scopus)

Abstract

Wafer-level testing allows detection of manufacturing errors and removes nonfunctional devices early in the fabrication process. It is commonly performed by placing a probe card directly above a device under test (DUT) and establishing a mechanical contact between them by means of an array of probes. This is an invasive technique that may damage fragile low-k dielectric layers and deform pads or bumps. More importantly, it is very difficult to flip thinned wafers face up for probing if they were earlier positioned face down for back grinding. Additional difficulty in handling of thinned wafers arises if dies have to be flipped again for bumping. One solution to above problems is wireless probing. With a number of proposed techniques for establishing high-speed inductive-coupling data links [3] and measuring DC analog signal wirelessly [4], the largest remaining obstacle to non-contact wafer-level testing is supplying power to the DUT. This is because wireless power transfer solutions reported earlier [1,5] do not provide an output power that is sufficient for testing modern high performance devices.

Original languageEnglish
Title of host publication2011 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, ISSCC 2011
Pages230-231
Number of pages2
DOIs
Publication statusPublished - 2011 May 12
Event2011 IEEE International Solid-State Circuits Conference, ISSCC 2011 - San Francisco, CA, United States
Duration: 2011 Feb 202011 Feb 24

Publication series

NameDigest of Technical Papers - IEEE International Solid-State Circuits Conference
ISSN (Print)0193-6530

Other

Other2011 IEEE International Solid-State Circuits Conference, ISSCC 2011
CountryUnited States
CitySan Francisco, CA
Period11/2/2011/2/24

    Fingerprint

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Radecki, A., Chung, H., Yoshida, Y., Miura, N., Shidei, T., Ishikuro, H., & Kuroda, T. (2011). 6W/25mm2 inductive power transfer for non-contact wafer-level testing. In 2011 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, ISSCC 2011 (pp. 230-231). [5746297] (Digest of Technical Papers - IEEE International Solid-State Circuits Conference). https://doi.org/10.1109/ISSCC.2011.5746297