6W/25mm2 inductive power transfer for non-contact wafer-level testing

Andrzej Radecki, Hayun Chung, Yoichi Yoshida, Noriyuki Miura, Tsunaaki Shidei, Hiroki Ishikuro, Tadahiro Kuroda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    38 Citations (Scopus)

    Abstract

    Wafer-level testing allows detection of manufacturing errors and removes nonfunctional devices early in the fabrication process. It is commonly performed by placing a probe card directly above a device under test (DUT) and establishing a mechanical contact between them by means of an array of probes. This is an invasive technique that may damage fragile low-k dielectric layers and deform pads or bumps. More importantly, it is very difficult to flip thinned wafers face up for probing if they were earlier positioned face down for back grinding. Additional difficulty in handling of thinned wafers arises if dies have to be flipped again for bumping. One solution to above problems is wireless probing. With a number of proposed techniques for establishing high-speed inductive-coupling data links [3] and measuring DC analog signal wirelessly [4], the largest remaining obstacle to non-contact wafer-level testing is supplying power to the DUT. This is because wireless power transfer solutions reported earlier [1,5] do not provide an output power that is sufficient for testing modern high performance devices.

    Original languageEnglish
    Title of host publication2011 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, ISSCC 2011
    Pages230-231
    Number of pages2
    DOIs
    Publication statusPublished - 2011 May 12
    Event2011 IEEE International Solid-State Circuits Conference, ISSCC 2011 - San Francisco, CA, United States
    Duration: 2011 Feb 202011 Feb 24

    Publication series

    NameDigest of Technical Papers - IEEE International Solid-State Circuits Conference
    ISSN (Print)0193-6530

    Other

    Other2011 IEEE International Solid-State Circuits Conference, ISSCC 2011
    CountryUnited States
    CitySan Francisco, CA
    Period11/2/2011/2/24

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Electrical and Electronic Engineering

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