80-Gbit/s MCM-C technologies for high-speed ATM switching systems

Katsuhiko Okazaki, Nobuaki Sugiura, Akio Harada, Naoaki Yamanaka, Eiji Oki

Research output: Contribution to journalConference articlepeer-review

6 Citations (Scopus)

Abstract

We have developed an ATM switch ceramic multichip module (MCM) that has an aluminum substrate. This MCM can support a high-density mounting and high-speed interconnection among LSI chips. Using LSI technology, ceramic-substrate technology, high-speed/high-power connector technology, and compact liquid-cooling technology, we built an 80-Gbit/s ATM switching module.

Original languageEnglish
Pages (from-to)284-288
Number of pages5
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume3830
Publication statusPublished - 1999 Dec 1
Externally publishedYes
EventProceedings of the 1999 International Conference on High Density Packaging and MCMs - Denver, CO, USA
Duration: 1999 Apr 61999 Apr 9

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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