A 0.15-mm-thick noncontact connector for mipi using a vertical directional coupler

Atsutake Kosuge, Wataru Mizuhara, Tsunaaki Shidei, Tsutomu Takeya, Noriyuki Miura, Masao Taguchi, Hiroki Ishikuro, Tadahiro Kuroda

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

A noncontact and housing-less thin-thick connecting method was developed for mobile industry processor interface (MIPI) applications. This paper describes the world's first 0.15-mm-thick connector using a vertical directional coupler (VDC) which enables simultaneous two-link communication with one coupler without fatal performance degradation. We have analyzed the conditions for isolating two links in a coupler, and the design method is discussed. A fully balanced pulse transmitter implemented in 90-nm CMOS technology significantly suppressed electromagnetic interference (EMI), which agrees well with MIPI requirements. An experimental liquid crystal display interface system reached a maximum data rate of 2.3 Gb/s/link at a bit error rate of less than 10-12 and a power consumption of 1.47~pJ/b. The timing margin of single link was 320 ps (=64% U.I.) and of two links was 305 ps (= 61% U.I.) at 2.0 Gb/s.

Original languageEnglish
Article number6616659
Pages (from-to)223-231
Number of pages9
JournalIEEE Journal of Solid-State Circuits
Volume49
Issue number1
DOIs
Publication statusPublished - 2014 Jan 1

    Fingerprint

Keywords

  • Directional coupler
  • Flexible printed circuit (FPC)
  • Liquid crystal display (LCD)
  • Mobile industry processor interface (MIPI)
  • Noncontact connector
  • Pulse transmitter

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this