A 1 Tb/s/mm2 inductive-coupling side-by-side chip link

So Hasegawa, Junichiro Kadomoto, Atsutake Kosuge, Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An inductive coupling technique for wireless interconnection of side-by-side chips within a package is presented. Data is transferred by using changes in magnetic field that occur when the current in coils on the chips is switched off. The circuit layout area and power consumption of transceivers have respectively been reduced to 1/3 and 1/6. A world-leading transmission rate of 1 Tb/s/mm2, which is faster by a factor of 3, has been achieved with a 0.18 μm CMOS test chip.

Original languageEnglish
Title of host publicationESSCIRC 2016: 42nd European Solid-State Circuits Conference
PublisherIEEE Computer Society
Pages469-472
Number of pages4
Volume2016-October
ISBN (Electronic)9781509029723
DOIs
Publication statusPublished - 2016 Oct 18
Event42nd European Solid-State Circuits Conference, ESSCIRC 2016 - Lausanne, Switzerland
Duration: 2016 Sep 122016 Sep 15

Other

Other42nd European Solid-State Circuits Conference, ESSCIRC 2016
CountrySwitzerland
CityLausanne
Period16/9/1216/9/15

Fingerprint

Integrated circuit layout
Transceivers
Telecommunication links
Electric power utilization
Magnetic fields

Keywords

  • inductive coupling
  • system in a package

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Hasegawa, S., Kadomoto, J., Kosuge, A., & Kuroda, T. (2016). A 1 Tb/s/mm2 inductive-coupling side-by-side chip link. In ESSCIRC 2016: 42nd European Solid-State Circuits Conference (Vol. 2016-October, pp. 469-472). [7598343] IEEE Computer Society. https://doi.org/10.1109/ESSCIRC.2016.7598343

A 1 Tb/s/mm2 inductive-coupling side-by-side chip link. / Hasegawa, So; Kadomoto, Junichiro; Kosuge, Atsutake; Kuroda, Tadahiro.

ESSCIRC 2016: 42nd European Solid-State Circuits Conference. Vol. 2016-October IEEE Computer Society, 2016. p. 469-472 7598343.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hasegawa, S, Kadomoto, J, Kosuge, A & Kuroda, T 2016, A 1 Tb/s/mm2 inductive-coupling side-by-side chip link. in ESSCIRC 2016: 42nd European Solid-State Circuits Conference. vol. 2016-October, 7598343, IEEE Computer Society, pp. 469-472, 42nd European Solid-State Circuits Conference, ESSCIRC 2016, Lausanne, Switzerland, 16/9/12. https://doi.org/10.1109/ESSCIRC.2016.7598343
Hasegawa S, Kadomoto J, Kosuge A, Kuroda T. A 1 Tb/s/mm2 inductive-coupling side-by-side chip link. In ESSCIRC 2016: 42nd European Solid-State Circuits Conference. Vol. 2016-October. IEEE Computer Society. 2016. p. 469-472. 7598343 https://doi.org/10.1109/ESSCIRC.2016.7598343
Hasegawa, So ; Kadomoto, Junichiro ; Kosuge, Atsutake ; Kuroda, Tadahiro. / A 1 Tb/s/mm2 inductive-coupling side-by-side chip link. ESSCIRC 2016: 42nd European Solid-State Circuits Conference. Vol. 2016-October IEEE Computer Society, 2016. pp. 469-472
@inproceedings{5fd51a0e3b71433dbfea6cf5643d45a9,
title = "A 1 Tb/s/mm2 inductive-coupling side-by-side chip link",
abstract = "An inductive coupling technique for wireless interconnection of side-by-side chips within a package is presented. Data is transferred by using changes in magnetic field that occur when the current in coils on the chips is switched off. The circuit layout area and power consumption of transceivers have respectively been reduced to 1/3 and 1/6. A world-leading transmission rate of 1 Tb/s/mm2, which is faster by a factor of 3, has been achieved with a 0.18 μm CMOS test chip.",
keywords = "inductive coupling, system in a package",
author = "So Hasegawa and Junichiro Kadomoto and Atsutake Kosuge and Tadahiro Kuroda",
year = "2016",
month = "10",
day = "18",
doi = "10.1109/ESSCIRC.2016.7598343",
language = "English",
volume = "2016-October",
pages = "469--472",
booktitle = "ESSCIRC 2016: 42nd European Solid-State Circuits Conference",
publisher = "IEEE Computer Society",

}

TY - GEN

T1 - A 1 Tb/s/mm2 inductive-coupling side-by-side chip link

AU - Hasegawa, So

AU - Kadomoto, Junichiro

AU - Kosuge, Atsutake

AU - Kuroda, Tadahiro

PY - 2016/10/18

Y1 - 2016/10/18

N2 - An inductive coupling technique for wireless interconnection of side-by-side chips within a package is presented. Data is transferred by using changes in magnetic field that occur when the current in coils on the chips is switched off. The circuit layout area and power consumption of transceivers have respectively been reduced to 1/3 and 1/6. A world-leading transmission rate of 1 Tb/s/mm2, which is faster by a factor of 3, has been achieved with a 0.18 μm CMOS test chip.

AB - An inductive coupling technique for wireless interconnection of side-by-side chips within a package is presented. Data is transferred by using changes in magnetic field that occur when the current in coils on the chips is switched off. The circuit layout area and power consumption of transceivers have respectively been reduced to 1/3 and 1/6. A world-leading transmission rate of 1 Tb/s/mm2, which is faster by a factor of 3, has been achieved with a 0.18 μm CMOS test chip.

KW - inductive coupling

KW - system in a package

UR - http://www.scopus.com/inward/record.url?scp=84994430616&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84994430616&partnerID=8YFLogxK

U2 - 10.1109/ESSCIRC.2016.7598343

DO - 10.1109/ESSCIRC.2016.7598343

M3 - Conference contribution

VL - 2016-October

SP - 469

EP - 472

BT - ESSCIRC 2016: 42nd European Solid-State Circuits Conference

PB - IEEE Computer Society

ER -