Abstract
An inductive coupling technique for wireless interconnection of side-by-side chips within a package is presented. Data is transferred by using changes in magnetic field that occur when the current in coils on the chips is switched off. The circuit layout area and power consumption of transceivers have respectively been reduced to 1/3 and 1/6. A world-leading transmission rate of 1 Tb/s/mm2, which is faster by a factor of 3, has been achieved with a 0.18 μm CMOS test chip.
Original language | English |
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Title of host publication | ESSCIRC 2016: 42nd European Solid-State Circuits Conference |
Publisher | IEEE Computer Society |
Pages | 469-472 |
Number of pages | 4 |
Volume | 2016-October |
ISBN (Electronic) | 9781509029723 |
DOIs | |
Publication status | Published - 2016 Oct 18 |
Event | 42nd European Solid-State Circuits Conference, ESSCIRC 2016 - Lausanne, Switzerland Duration: 2016 Sep 12 → 2016 Sep 15 |
Other
Other | 42nd European Solid-State Circuits Conference, ESSCIRC 2016 |
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Country/Territory | Switzerland |
City | Lausanne |
Period | 16/9/12 → 16/9/15 |
Keywords
- inductive coupling
- system in a package
ASJC Scopus subject areas
- Hardware and Architecture
- Electrical and Electronic Engineering