A 1 Tb/s/mm2 inductive-coupling side-by-side chip link

So Hasegawa, Junichiro Kadomoto, Atsutake Kosuge, Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

An inductive coupling technique for wireless interconnection of side-by-side chips within a package is presented. Data is transferred by using changes in magnetic field that occur when the current in coils on the chips is switched off. The circuit layout area and power consumption of transceivers have respectively been reduced to 1/3 and 1/6. A world-leading transmission rate of 1 Tb/s/mm2, which is faster by a factor of 3, has been achieved with a 0.18 μm CMOS test chip.

Original languageEnglish
Title of host publicationESSCIRC 2016: 42nd European Solid-State Circuits Conference
PublisherIEEE Computer Society
Pages469-472
Number of pages4
Volume2016-October
ISBN (Electronic)9781509029723
DOIs
Publication statusPublished - 2016 Oct 18
Event42nd European Solid-State Circuits Conference, ESSCIRC 2016 - Lausanne, Switzerland
Duration: 2016 Sep 122016 Sep 15

Other

Other42nd European Solid-State Circuits Conference, ESSCIRC 2016
CountrySwitzerland
CityLausanne
Period16/9/1216/9/15

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Keywords

  • inductive coupling
  • system in a package

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Hasegawa, S., Kadomoto, J., Kosuge, A., & Kuroda, T. (2016). A 1 Tb/s/mm2 inductive-coupling side-by-side chip link. In ESSCIRC 2016: 42nd European Solid-State Circuits Conference (Vol. 2016-October, pp. 469-472). [7598343] IEEE Computer Society. https://doi.org/10.1109/ESSCIRC.2016.7598343