A 1 Tb/s/mm2 inductive-coupling side-by-side chip link

So Hasegawa, Junichiro Kadomoto, Atsutake Kosuge, Tadahiro Kuroda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)

    Abstract

    An inductive coupling technique for wireless interconnection of side-by-side chips within a package is presented. Data is transferred by using changes in magnetic field that occur when the current in coils on the chips is switched off. The circuit layout area and power consumption of transceivers have respectively been reduced to 1/3 and 1/6. A world-leading transmission rate of 1 Tb/s/mm2, which is faster by a factor of 3, has been achieved with a 0.18 μm CMOS test chip.

    Original languageEnglish
    Title of host publicationESSCIRC 2016: 42nd European Solid-State Circuits Conference
    PublisherIEEE Computer Society
    Pages469-472
    Number of pages4
    Volume2016-October
    ISBN (Electronic)9781509029723
    DOIs
    Publication statusPublished - 2016 Oct 18
    Event42nd European Solid-State Circuits Conference, ESSCIRC 2016 - Lausanne, Switzerland
    Duration: 2016 Sep 122016 Sep 15

    Other

    Other42nd European Solid-State Circuits Conference, ESSCIRC 2016
    CountrySwitzerland
    CityLausanne
    Period16/9/1216/9/15

    Keywords

    • inductive coupling
    • system in a package

    ASJC Scopus subject areas

    • Hardware and Architecture
    • Electrical and Electronic Engineering

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  • Cite this

    Hasegawa, S., Kadomoto, J., Kosuge, A., & Kuroda, T. (2016). A 1 Tb/s/mm2 inductive-coupling side-by-side chip link. In ESSCIRC 2016: 42nd European Solid-State Circuits Conference (Vol. 2016-October, pp. 469-472). [7598343] IEEE Computer Society. https://doi.org/10.1109/ESSCIRC.2016.7598343