TY - GEN
T1 - A 12Gb/s non-contact interface with coupled transmission lines
AU - Takeya, Tsutomu
AU - Nan, Lan
AU - Nakano, Shinya
AU - Miura, Noriyuki
AU - Ishikuro, Hiroki
AU - Kuroda, Tadahiro
PY - 2011/5/12
Y1 - 2011/5/12
N2 - The expanding capacity of today's memory cards and increasing speed of processors have created demands for high data rate interfaces between memory cards and processors. Compared to conventional contact pins, wireless interfaces have received tremendous interest for reasons of more convenience, higher reliability, and higher data rate. Two major types of near-field wireless communication techniques using capacitive coupling and inductive coupling channels have been investigated. Tens of Gb/s/ch is achieved using both methods with a communication distance of tens of microns in TCI (thru-chip-interface) applications [1-2]. However, when the communication distance denters the mm range in such applications as non-contact memory cards, the sizes of capacitors or inductors must be up scaled to detect enough electrical flux or magnetic flux, whose magnitude decay as 1/dn (n>1). As a result, the self-resonance frequency fSR is reduced significantly, which becomes the dominant limiting factor for the achievable data rate, since the maximum data rate is usually chosen as 1/2 or 1/3 of fSR in order to avoid signal peaking [3]. Although multi-channel solutions are viable to increase the total data rate, complex systems are required to address the skew issues in synchronization, and low area efficiency is resulted to reduce crosstalk interferences as shown in Fig. 28.3.1.
AB - The expanding capacity of today's memory cards and increasing speed of processors have created demands for high data rate interfaces between memory cards and processors. Compared to conventional contact pins, wireless interfaces have received tremendous interest for reasons of more convenience, higher reliability, and higher data rate. Two major types of near-field wireless communication techniques using capacitive coupling and inductive coupling channels have been investigated. Tens of Gb/s/ch is achieved using both methods with a communication distance of tens of microns in TCI (thru-chip-interface) applications [1-2]. However, when the communication distance denters the mm range in such applications as non-contact memory cards, the sizes of capacitors or inductors must be up scaled to detect enough electrical flux or magnetic flux, whose magnitude decay as 1/dn (n>1). As a result, the self-resonance frequency fSR is reduced significantly, which becomes the dominant limiting factor for the achievable data rate, since the maximum data rate is usually chosen as 1/2 or 1/3 of fSR in order to avoid signal peaking [3]. Although multi-channel solutions are viable to increase the total data rate, complex systems are required to address the skew issues in synchronization, and low area efficiency is resulted to reduce crosstalk interferences as shown in Fig. 28.3.1.
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U2 - 10.1109/ISSCC.2011.5746411
DO - 10.1109/ISSCC.2011.5746411
M3 - Conference contribution
AN - SCOPUS:79955712454
SN - 9781612843001
T3 - Digest of Technical Papers - IEEE International Solid-State Circuits Conference
SP - 492
EP - 493
BT - 2011 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, ISSCC 2011
T2 - 2011 IEEE International Solid-State Circuits Conference, ISSCC 2011
Y2 - 20 February 2011 through 24 February 2011
ER -