A 1.2Gb/s/pin wireless superconnect based on Inductive Inter-chip Signaling (IIS)

Daisuke Mizoguchi, Yusmeeraz Binti Yusof, Noriyuki Miura, Takayasu Sakurai, Tadahiro Kuroda

Research output: Contribution to journalConference article

81 Citations (Scopus)

Abstract

A wireless bus for stacked chips is designed with the interface using inductive coupling with metal spiral inductors. Transceiver circuits for non-return-to-zero signaling are developed. Test chips stacked at a distance of 300μm communicate at data rates of up to 1.2Gb/s/pin. Fabricated in 0.35μm CMOS technology, TX and RX dissipation are 43 and 2.5mW, respectively.

Original languageEnglish
Pages (from-to)142-143+131+517
JournalDigest of Technical Papers - IEEE International Solid-State Circuits Conference
Volume47
Publication statusPublished - 2004 Jun 2
EventDigest of Technical Papers - 2004 IEEE International Solid-State Circuits Conference - San Francisco, CA., United States
Duration: 2003 Feb 152003 Feb 19

    Fingerprint

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this