A 195-gb/s 1.2-W inductive inter-chip wireless superconnect with transmit power control scheme for 3-D-stacked system in a package

N. Miura, D. Mizoguchi, M. Inoue, T. Sakurai, T. Kuroda

    Research output: Contribution to journalArticle

    58 Citations (Scopus)

    Abstract

    A wireless interface by inductive coupling achieves aggregated data rate of 195 Gb/s with power dissipation of 1.2W among 4-stacked chips in a package where 195 transceivers with the data rate of 1 Gb/s/channel are arranged in 50-/spl mu/m pitch in 0.25-/spl mu/m CMOS technology. By thinning chip thickness to 10/spl mu/m, the interface communicates at distance of 15 /spl mu/ m at minimum and 43 /spl mu/m at maximum. A low-power single-end transmitter achieves 55% power reduction for multiple connections. The transmit power is dynamically controlled in accordance with communication distance to reduce not only power dissipation but also crosstalk.

    Original languageEnglish
    Pages (from-to)23-34
    Number of pages12
    JournalIEEE Journal of Solid-State Circuits
    Volume41
    Issue number1
    DOIs
    Publication statusPublished - 2006 Jan 1

    Keywords

    • 1. 2 W
    • 195 Gbit/s
    • 3D stacked system in a package
    • 50 micron
    • CMOS technology
    • Crosstalk
    • Inductive coupling
    • Inductive interchip wireless superconnect
    • Low power single end transmitter
    • Power dissipation
    • Transmit power control scheme
    • Wireless interconnect

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

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