A 195-gb/s 1.2-W inductive inter-chip wireless superconnect with transmit power control scheme for 3-D-stacked system in a package

N. Miura, D. Mizoguchi, M. Inoue, T. Sakurai, Tadahiro Kuroda

Research output: Contribution to journalArticle

56 Citations (Scopus)

Abstract

A wireless interface by inductive coupling achieves aggregated data rate of 195 Gb/s with power dissipation of 1.2W among 4-stacked chips in a package where 195 transceivers with the data rate of 1 Gb/s/channel are arranged in 50-/spl mu/m pitch in 0.25-/spl mu/m CMOS technology. By thinning chip thickness to 10/spl mu/m, the interface communicates at distance of 15 /spl mu/ m at minimum and 43 /spl mu/m at maximum. A low-power single-end transmitter achieves 55% power reduction for multiple connections. The transmit power is dynamically controlled in accordance with communication distance to reduce not only power dissipation but also crosstalk.

Original languageEnglish
Pages (from-to)23-34
Number of pages12
JournalIEEE Journal of Solid-State Circuits
Volume41
Issue number1
DOIs
Publication statusPublished - 2006 Jan

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Power control
Energy dissipation
Crosstalk
Transceivers
Transmitters
Communication

Keywords

  • 1. 2 W
  • 195 Gbit/s
  • 3D stacked system in a package
  • 50 micron
  • CMOS technology
  • Crosstalk
  • Inductive coupling
  • Inductive interchip wireless superconnect
  • Low power single end transmitter
  • Power dissipation
  • Transmit power control scheme
  • Wireless interconnect

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

A 195-gb/s 1.2-W inductive inter-chip wireless superconnect with transmit power control scheme for 3-D-stacked system in a package. / Miura, N.; Mizoguchi, D.; Inoue, M.; Sakurai, T.; Kuroda, Tadahiro.

In: IEEE Journal of Solid-State Circuits, Vol. 41, No. 1, 01.2006, p. 23-34.

Research output: Contribution to journalArticle

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