A 195-gb/s 1.2-W inductive inter-chip wireless superconnect with transmit power control scheme for 3-D-stacked system in a package

N. Miura, D. Mizoguchi, M. Inoue, T. Sakurai, T. Kuroda

Research output: Contribution to journalArticlepeer-review

62 Citations (Scopus)

Fingerprint

Dive into the research topics of 'A 195-gb/s 1.2-W inductive inter-chip wireless superconnect with transmit power control scheme for 3-D-stacked system in a package'. Together they form a unique fingerprint.

Engineering & Materials Science