A 195Gb/s 1.2W 30-stacked inductive inter-chip wireless superconnect with transmit power control scheme

Noriyuki Miura, Daisuke Mizoguchi, Mari Inoue, Hiroo Tsuji, Takayasu Sakurai, Tadahiro Kuroda

    Research output: Contribution to journalConference article

    6 Citations (Scopus)

    Abstract

    An inductively coupled wireless interface achieves aggregated data rate of 195Gb/s among 4 stacked chips in a package by arranging 195 transceivers in 50μm pitch with power dissipation of 1.2W. The transmit power is controlled in accordance to the communication distance to reduce both the power dissipation and the cross-talk of the system.

    Original languageEnglish
    Article number14.5
    Pages (from-to)210-211+602
    JournalDigest of Technical Papers - IEEE International Solid-State Circuits Conference
    Volume48
    Publication statusPublished - 2005 Dec 6
    Event2005 IEEE International Solid-State Circuits Conference, ISSCC - San Francisco, CA, United States
    Duration: 2005 Feb 62005 Feb 10

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Electrical and Electronic Engineering

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