An inductively coupled wireless interface achieves aggregated data rate of 195Gb/s among 4 stacked chips in a package by arranging 195 transceivers in 50μm pitch with power dissipation of 1.2W. The transmit power is controlled in accordance to the communication distance to reduce both the power dissipation and the cross-talk of the system.
|Journal||Digest of Technical Papers - IEEE International Solid-State Circuits Conference|
|Publication status||Published - 2005 Dec 6|
|Event||2005 IEEE International Solid-State Circuits Conference, ISSCC - San Francisco, CA, United States|
Duration: 2005 Feb 6 → 2005 Feb 10
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering