A 195Gb/s 1.2W 30-stacked inductive inter-chip wireless superconnect with transmit power control scheme

Noriyuki Miura, Daisuke Mizoguchi, Mari Inoue, Hiroo Tsuji, Takayasu Sakurai, Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

An inductively coupled wireless interface achieves aggregated data rate of 195Gb/s among 4 stacked chips in a package by arranging 195 transceivers in 50μm pitch with power dissipation of 1.2W. The transmit power is controlled in accordance to the communication distance to reduce both the power dissipation and the cross-talk of the system.

Original languageEnglish
Title of host publicationDigest of Technical Papers - IEEE International Solid-State Circuits Conference
Volume48
Publication statusPublished - 2005
Event2005 IEEE International Solid-State Circuits Conference, ISSCC - San Francisco, CA, United States
Duration: 2005 Feb 62005 Feb 10

Other

Other2005 IEEE International Solid-State Circuits Conference, ISSCC
CountryUnited States
CitySan Francisco, CA
Period05/2/605/2/10

Fingerprint

Power control
Energy dissipation
Transceivers
Communication

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Hardware and Architecture

Cite this

Miura, N., Mizoguchi, D., Inoue, M., Tsuji, H., Sakurai, T., & Kuroda, T. (2005). A 195Gb/s 1.2W 30-stacked inductive inter-chip wireless superconnect with transmit power control scheme. In Digest of Technical Papers - IEEE International Solid-State Circuits Conference (Vol. 48). [14.5]

A 195Gb/s 1.2W 30-stacked inductive inter-chip wireless superconnect with transmit power control scheme. / Miura, Noriyuki; Mizoguchi, Daisuke; Inoue, Mari; Tsuji, Hiroo; Sakurai, Takayasu; Kuroda, Tadahiro.

Digest of Technical Papers - IEEE International Solid-State Circuits Conference. Vol. 48 2005. 14.5.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Miura, N, Mizoguchi, D, Inoue, M, Tsuji, H, Sakurai, T & Kuroda, T 2005, A 195Gb/s 1.2W 30-stacked inductive inter-chip wireless superconnect with transmit power control scheme. in Digest of Technical Papers - IEEE International Solid-State Circuits Conference. vol. 48, 14.5, 2005 IEEE International Solid-State Circuits Conference, ISSCC, San Francisco, CA, United States, 05/2/6.
Miura N, Mizoguchi D, Inoue M, Tsuji H, Sakurai T, Kuroda T. A 195Gb/s 1.2W 30-stacked inductive inter-chip wireless superconnect with transmit power control scheme. In Digest of Technical Papers - IEEE International Solid-State Circuits Conference. Vol. 48. 2005. 14.5
Miura, Noriyuki ; Mizoguchi, Daisuke ; Inoue, Mari ; Tsuji, Hiroo ; Sakurai, Takayasu ; Kuroda, Tadahiro. / A 195Gb/s 1.2W 30-stacked inductive inter-chip wireless superconnect with transmit power control scheme. Digest of Technical Papers - IEEE International Solid-State Circuits Conference. Vol. 48 2005.
@inproceedings{432c2558e66044edb7263170e06c47f9,
title = "A 195Gb/s 1.2W 30-stacked inductive inter-chip wireless superconnect with transmit power control scheme",
abstract = "An inductively coupled wireless interface achieves aggregated data rate of 195Gb/s among 4 stacked chips in a package by arranging 195 transceivers in 50μm pitch with power dissipation of 1.2W. The transmit power is controlled in accordance to the communication distance to reduce both the power dissipation and the cross-talk of the system.",
author = "Noriyuki Miura and Daisuke Mizoguchi and Mari Inoue and Hiroo Tsuji and Takayasu Sakurai and Tadahiro Kuroda",
year = "2005",
language = "English",
volume = "48",
booktitle = "Digest of Technical Papers - IEEE International Solid-State Circuits Conference",

}

TY - GEN

T1 - A 195Gb/s 1.2W 30-stacked inductive inter-chip wireless superconnect with transmit power control scheme

AU - Miura, Noriyuki

AU - Mizoguchi, Daisuke

AU - Inoue, Mari

AU - Tsuji, Hiroo

AU - Sakurai, Takayasu

AU - Kuroda, Tadahiro

PY - 2005

Y1 - 2005

N2 - An inductively coupled wireless interface achieves aggregated data rate of 195Gb/s among 4 stacked chips in a package by arranging 195 transceivers in 50μm pitch with power dissipation of 1.2W. The transmit power is controlled in accordance to the communication distance to reduce both the power dissipation and the cross-talk of the system.

AB - An inductively coupled wireless interface achieves aggregated data rate of 195Gb/s among 4 stacked chips in a package by arranging 195 transceivers in 50μm pitch with power dissipation of 1.2W. The transmit power is controlled in accordance to the communication distance to reduce both the power dissipation and the cross-talk of the system.

UR - http://www.scopus.com/inward/record.url?scp=28144442025&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=28144442025&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:28144442025

VL - 48

BT - Digest of Technical Papers - IEEE International Solid-State Circuits Conference

ER -