A 195Gb/s 1.2W 3D-stacked inductive inter-chip wireless superconnect with transmit power control scheme

Noriyuki Miura, Daisuke Mizoguchi, Mari Inoue, Hiroo Tsuji, Takayasu Sakurai, Tadahiro Kuroda

    Research output: Contribution to journalConference article

    47 Citations (Scopus)
    Original languageEnglish
    Pages (from-to)264-265+597
    JournalDigest of Technical Papers - IEEE International Solid-State Circuits Conference
    Volume48
    Publication statusPublished - 2005 Dec 6
    Event2005 IEEE International Solid-State Circuits Conference, ISSCC - San Francisco, CA, United States
    Duration: 2005 Feb 62005 Feb 10

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Electrical and Electronic Engineering

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