A 195Gb/s 1.2W 3D-stacked inductive inter-chip wireless superconnect with transmit power control scheme

Noriyuki Miura, Daisuke Mizoguchi, Mari Inoue, Hiroo Tsuji, Takayasu Sakurai, Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

46 Citations (Scopus)
Original languageEnglish
Title of host publicationDigest of Technical Papers - IEEE International Solid-State Circuits Conference
Volume48
Publication statusPublished - 2005
Event2005 IEEE International Solid-State Circuits Conference, ISSCC - San Francisco, CA, United States
Duration: 2005 Feb 62005 Feb 10

Other

Other2005 IEEE International Solid-State Circuits Conference, ISSCC
CountryUnited States
CitySan Francisco, CA
Period05/2/605/2/10

Fingerprint

Power control

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Hardware and Architecture

Cite this

Miura, N., Mizoguchi, D., Inoue, M., Tsuji, H., Sakurai, T., & Kuroda, T. (2005). A 195Gb/s 1.2W 3D-stacked inductive inter-chip wireless superconnect with transmit power control scheme. In Digest of Technical Papers - IEEE International Solid-State Circuits Conference (Vol. 48)

A 195Gb/s 1.2W 3D-stacked inductive inter-chip wireless superconnect with transmit power control scheme. / Miura, Noriyuki; Mizoguchi, Daisuke; Inoue, Mari; Tsuji, Hiroo; Sakurai, Takayasu; Kuroda, Tadahiro.

Digest of Technical Papers - IEEE International Solid-State Circuits Conference. Vol. 48 2005.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Miura, N, Mizoguchi, D, Inoue, M, Tsuji, H, Sakurai, T & Kuroda, T 2005, A 195Gb/s 1.2W 3D-stacked inductive inter-chip wireless superconnect with transmit power control scheme. in Digest of Technical Papers - IEEE International Solid-State Circuits Conference. vol. 48, 2005 IEEE International Solid-State Circuits Conference, ISSCC, San Francisco, CA, United States, 05/2/6.
Miura N, Mizoguchi D, Inoue M, Tsuji H, Sakurai T, Kuroda T. A 195Gb/s 1.2W 3D-stacked inductive inter-chip wireless superconnect with transmit power control scheme. In Digest of Technical Papers - IEEE International Solid-State Circuits Conference. Vol. 48. 2005
Miura, Noriyuki ; Mizoguchi, Daisuke ; Inoue, Mari ; Tsuji, Hiroo ; Sakurai, Takayasu ; Kuroda, Tadahiro. / A 195Gb/s 1.2W 3D-stacked inductive inter-chip wireless superconnect with transmit power control scheme. Digest of Technical Papers - IEEE International Solid-State Circuits Conference. Vol. 48 2005.
@inproceedings{8d010b0710254ec7bbb183a645ecd056,
title = "A 195Gb/s 1.2W 3D-stacked inductive inter-chip wireless superconnect with transmit power control scheme",
author = "Noriyuki Miura and Daisuke Mizoguchi and Mari Inoue and Hiroo Tsuji and Takayasu Sakurai and Tadahiro Kuroda",
year = "2005",
language = "English",
volume = "48",
booktitle = "Digest of Technical Papers - IEEE International Solid-State Circuits Conference",

}

TY - GEN

T1 - A 195Gb/s 1.2W 3D-stacked inductive inter-chip wireless superconnect with transmit power control scheme

AU - Miura, Noriyuki

AU - Mizoguchi, Daisuke

AU - Inoue, Mari

AU - Tsuji, Hiroo

AU - Sakurai, Takayasu

AU - Kuroda, Tadahiro

PY - 2005

Y1 - 2005

UR - http://www.scopus.com/inward/record.url?scp=25844471777&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=25844471777&partnerID=8YFLogxK

M3 - Conference contribution

VL - 48

BT - Digest of Technical Papers - IEEE International Solid-State Circuits Conference

ER -