A 2 Gb/s bi-directional inter-chip data transceiver is experimentally demonstrated for the first time in 180 nm CMOS technology. Two orthogonal differential inductor pairs are vertically overlapped to make a bi-directional channel. Using these channels, bi-directional communication system is established without any complex circuit techniques. The crosstalk interference problem in channel array is also considered. Differential inductors, due to their noise immunity can make shorter pitches possible in channel array. Compared with the data link with conventional inductor array, this proposed technique achieves 64% area reduction with the same speed.
|Number of pages||7|
|Journal||IEEE Journal of Solid-State Circuits|
|Publication status||Published - 2008 Nov|
- 3-D system integration
ASJC Scopus subject areas
- Electrical and Electronic Engineering