A 6Gb/s 6pJ/b 5mm-distance non-contact interface for modular smartphones using two-fold transmission-line coupler and EMC-qualified pulse transceiver

Atsutake Kosuge, Shu Ishizuka, Junichiro Kadomoto, Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

Modular smart phones have been attracting attention (Fig. 10.1.1) because users can freely customize their phones by purchasing modules and assembling them [1]. The transfer of data between modules is accomplished by non-contact connectors. Because the connection electrodes are not exposed, there is no wear or damage and waterproofing is possible. The methods of constructing non-contact connectors include capacitive coupling, which uses flat plate electrodes [1], magnetic coupling, which uses coils [2-4], and electromagnetic coupling, which uses transmission-line couplers (TLC) [5-7]. Capacitive and magnetic coupling can be used only for narrowband communication below the resonance frequency (<1GHz). Because impedance varies with frequency, impedance matching is not possible for digital signals that include a wide range of frequency components. For that reason, these couplers can be used for the MIPI D-PHY data rate (1Gb/s), but not for M-PHY (6Gb/s). The TLC, however, can be used for broadband communication (>6GHz). Because the impedance is constant, there is little reflection and digital communication is possible. A data transfer speed of 12Gb/s has been reported for a distance of 1mm between couplers [5]. Thus, full HD (4Gb/s) or 4K (15Gb/s) video data can be transmitted over a small number of lanes.

Original languageEnglish
Title of host publicationDigest of Technical Papers - IEEE International Solid-State Circuits Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages176-177
Number of pages2
Volume58
ISBN (Print)9781479962235
DOIs
Publication statusPublished - 2015 Mar 17
Event2015 62nd IEEE International Solid-State Circuits Conference, ISSCC 2015 - Digest of Technical Papers - San Francisco, United States
Duration: 2015 Feb 222015 Feb 26

Other

Other2015 62nd IEEE International Solid-State Circuits Conference, ISSCC 2015 - Digest of Technical Papers
CountryUnited States
CitySan Francisco
Period15/2/2215/2/26

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Kosuge, A., Ishizuka, S., Kadomoto, J., & Kuroda, T. (2015). A 6Gb/s 6pJ/b 5mm-distance non-contact interface for modular smartphones using two-fold transmission-line coupler and EMC-qualified pulse transceiver. In Digest of Technical Papers - IEEE International Solid-State Circuits Conference (Vol. 58, pp. 176-177). [7062983] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISSCC.2015.7062983