A 7Gb/s/link non-contact memory module for multi-drop bus system using energy-equipartitioned coupled transmission line

Won Joo Yun, Shinya Nakano, Wataru Mizuhara, Atsutake Kosuge, Noriyuki Miura, Hiroki Ishikuro, Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

16 Citations (Scopus)

Abstract

As computing power and speed increases, the demand for higher memory bandwidth increases as well. Recently, the memory interface has been improved up to 20Gb/s/link [1]. Considering PCB routing area, a multi-drop bus architecture is still preferable for large memory capacity to the point-to-point connection. However, the multi-drop approach suffers from performance degradations due to reflections at each stub. To mitigate this problem, reference [2] proposes an impedance-matched bidirectional multi-drop DQ bus architecture that is difficult to realize due to smaller series resistor if more than 4 modules are used. To avoid multi-reflections from each stub, other approaches have used coupled transmission lines (CTL) [3, 4]. While a horizontal directional coupler buried in the PCB was used [3], coupled traces on the bent loop of flex fixed to a module were used for signal delivery in vertical direction [4]. In [3], a long coupler with long main bus line was used so that the signal integrity degrades at the far-end coupler. In [4], the coupling traces on the motherboard and the flex have zigzag geometries for better misalignment tolerance, which result in large area of routing due to the minimum required pitch between traces. In [5], the CTL needs to be placed close to a Tx/Rx chip, as there are no extended transmission lines for signal lead. Therefore, it cannot be used for memory modules. DRAM multi-drop bus interface technology mapping is described in Fig. 2.8.1.

Original languageEnglish
Title of host publicationDigest of Technical Papers - IEEE International Solid-State Circuits Conference
Pages52-53
Number of pages2
Volume55
DOIs
Publication statusPublished - 2012
Event59th International Solid-State Circuits Conference, ISSCC 2012 - San Francisco, CA, United States
Duration: 2012 Feb 192012 Feb 23

Other

Other59th International Solid-State Circuits Conference, ISSCC 2012
CountryUnited States
CitySan Francisco, CA
Period12/2/1912/2/23

Fingerprint

Electric lines
Data storage equipment
Polychlorinated Biphenyls
Polychlorinated biphenyls
Interfaces (computer)
Directional couplers
Dynamic random access storage
Resistors
Telecommunication links
Lead
Bandwidth
Degradation
Geometry

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Yun, W. J., Nakano, S., Mizuhara, W., Kosuge, A., Miura, N., Ishikuro, H., & Kuroda, T. (2012). A 7Gb/s/link non-contact memory module for multi-drop bus system using energy-equipartitioned coupled transmission line. In Digest of Technical Papers - IEEE International Solid-State Circuits Conference (Vol. 55, pp. 52-53). [6176875] https://doi.org/10.1109/ISSCC.2012.6176875

A 7Gb/s/link non-contact memory module for multi-drop bus system using energy-equipartitioned coupled transmission line. / Yun, Won Joo; Nakano, Shinya; Mizuhara, Wataru; Kosuge, Atsutake; Miura, Noriyuki; Ishikuro, Hiroki; Kuroda, Tadahiro.

Digest of Technical Papers - IEEE International Solid-State Circuits Conference. Vol. 55 2012. p. 52-53 6176875.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yun, WJ, Nakano, S, Mizuhara, W, Kosuge, A, Miura, N, Ishikuro, H & Kuroda, T 2012, A 7Gb/s/link non-contact memory module for multi-drop bus system using energy-equipartitioned coupled transmission line. in Digest of Technical Papers - IEEE International Solid-State Circuits Conference. vol. 55, 6176875, pp. 52-53, 59th International Solid-State Circuits Conference, ISSCC 2012, San Francisco, CA, United States, 12/2/19. https://doi.org/10.1109/ISSCC.2012.6176875
Yun WJ, Nakano S, Mizuhara W, Kosuge A, Miura N, Ishikuro H et al. A 7Gb/s/link non-contact memory module for multi-drop bus system using energy-equipartitioned coupled transmission line. In Digest of Technical Papers - IEEE International Solid-State Circuits Conference. Vol. 55. 2012. p. 52-53. 6176875 https://doi.org/10.1109/ISSCC.2012.6176875
Yun, Won Joo ; Nakano, Shinya ; Mizuhara, Wataru ; Kosuge, Atsutake ; Miura, Noriyuki ; Ishikuro, Hiroki ; Kuroda, Tadahiro. / A 7Gb/s/link non-contact memory module for multi-drop bus system using energy-equipartitioned coupled transmission line. Digest of Technical Papers - IEEE International Solid-State Circuits Conference. Vol. 55 2012. pp. 52-53
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