A case for wireless 3D NoCs for CMPs

Hiroki Matsutani; Paul Bogdan; Radu Marculescu; Yasuhiro Take; Daisuke Sasaki; Hao Zhang; Michihiro Koibuchi; Tadahiro Kuroda; Hideharu Amano

doi:10.1109/ASPDAC.2013.6509553

A case for wireless 3D NoCs for CMPs

Hiroki Matsutani, Paul Bogdan, Radu Marculescu, Yasuhiro Take, Daisuke Sasaki, Hao Zhang, Michihiro Koibuchi, Tadahiro Kuroda, Hideharu Amano

Department of Information and Computer Science

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

42 Citations (Scopus)

Abstract

Inductive-coupling is yet another 3D integration technique that can be used to stack more than three known-good-dies in a SiP without wire connections. We present a topology-agnostic 3D CMP architecture using inductive-coupling that offers great flexibility in customizing the number of processor chips, SRAM chips, and DRAM chips in a SiP after chips have been fabricated. In this paper, first, we propose a routing protocol that exchanges the network information between all chips in a given SiP to establish efficient deadlock-free routing paths. Second, we propose its optimization technique that analyzes the application traffic patterns and selects different spanning tree roots so as to minimize the average hop counts and improve the application performance.

Original language	English
Title of host publication	2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013
Pages	23-28
Number of pages	6
DOIs	https://doi.org/10.1109/ASPDAC.2013.6509553
Publication status	Published - 2013 May 20
Event	2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013 - Yokohama, Japan Duration: 2013 Jan 22 → 2013 Jan 25

Publication series

Name	Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Other

Other	2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013
Country/Territory	Japan
City	Yokohama
Period	13/1/22 → 13/1/25

ASJC Scopus subject areas

Computer Science Applications
Computer Graphics and Computer-Aided Design
Electrical and Electronic Engineering

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10.1109/ASPDAC.2013.6509553

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Matsutani, H., Bogdan, P., Marculescu, R., Take, Y., Sasaki, D., Zhang, H., Koibuchi, M., Kuroda, T., & Amano, H. (2013). A case for wireless 3D NoCs for CMPs. In 2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013 (pp. 23-28). [6509553] (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC). https://doi.org/10.1109/ASPDAC.2013.6509553

Matsutani, H, Bogdan, P, Marculescu, R, Take, Y, Sasaki, D, Zhang, H, Koibuchi, M, Kuroda, T & Amano, H 2013, A case for wireless 3D NoCs for CMPs. in 2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013., 6509553, Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC, pp. 23-28, 2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013, Yokohama, Japan, 13/1/22. https://doi.org/10.1109/ASPDAC.2013.6509553

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abstract = "Inductive-coupling is yet another 3D integration technique that can be used to stack more than three known-good-dies in a SiP without wire connections. We present a topology-agnostic 3D CMP architecture using inductive-coupling that offers great flexibility in customizing the number of processor chips, SRAM chips, and DRAM chips in a SiP after chips have been fabricated. In this paper, first, we propose a routing protocol that exchanges the network information between all chips in a given SiP to establish efficient deadlock-free routing paths. Second, we propose its optimization technique that analyzes the application traffic patterns and selects different spanning tree roots so as to minimize the average hop counts and improve the application performance.",

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AU - Zhang, Hao

AU - Koibuchi, Michihiro

AU - Kuroda, Tadahiro

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A case for wireless 3D NoCs for CMPs

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