A case for wireless 3D NoCs for CMPs

Hiroki Matsutani, Paul Bogdan, Radu Marculescu, Yasuhiro Take, Daisuke Sasaki, Hao Zhang, Michihiro Koibuchi, Tadahiro Kuroda, Hideharu Amano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

36 Citations (Scopus)

Abstract

Inductive-coupling is yet another 3D integration technique that can be used to stack more than three known-good-dies in a SiP without wire connections. We present a topology-agnostic 3D CMP architecture using inductive-coupling that offers great flexibility in customizing the number of processor chips, SRAM chips, and DRAM chips in a SiP after chips have been fabricated. In this paper, first, we propose a routing protocol that exchanges the network information between all chips in a given SiP to establish efficient deadlock-free routing paths. Second, we propose its optimization technique that analyzes the application traffic patterns and selects different spanning tree roots so as to minimize the average hop counts and improve the application performance.

Original languageEnglish
Title of host publication2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013
Pages23-28
Number of pages6
DOIs
Publication statusPublished - 2013 May 20
Event2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013 - Yokohama, Japan
Duration: 2013 Jan 222013 Jan 25

Publication series

NameProceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Other

Other2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013
CountryJapan
CityYokohama
Period13/1/2213/1/25

ASJC Scopus subject areas

  • Computer Science Applications
  • Computer Graphics and Computer-Aided Design
  • Electrical and Electronic Engineering

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