A comparative study of a new microscale technique and conventional bending techniques for evaluating the Interface adhesion strength in IC metallization systems

Shoji Kamiya, Hiroshi Shimomura, Masaki Omiya, Takashi Suzuki

Research output: Contribution to journalArticlepeer-review

11 Citations (Scopus)

Abstract

We developed a new microscale technique for evaluating the local interface adhesion in a thin film stack and we compared it with a conventional four-point bending technique. Using the microscale technique, the interface adhesion was estimated to be 3.0 J/m2 by comparing experimental results with numerical simulation results for interface crack propagation behavior. The four-point bending technique was applied to the same interface and the interface adhesion was estimated to be 4.4 J/m2T by experiment. However, this value Is an overestimate because It includes the plastic deformation of epoxy resin used to fabricate the specimens. By eliminating the additional energy dissipated through plastic deformation of the epoxy resin close to the interface crack tip, the interface adhesion was evaluated to be 3.3 J/m2. This value agrees well with that obtained using the microscale technique.

Original languageEnglish
Pages (from-to)1917-1928
Number of pages12
JournalJournal of Materials Research
Volume25
Issue number10
DOIs
Publication statusPublished - 2010 Oct 1

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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