Abstract
A mechanical reliability of the solder joints is a serious concern. Intermetallic compounds are formed during reflow process between solder and electrical pads and gradually grow in service. Due to it's brittle manner, the reliability of solder joints are supposed to degenerate. By using the Cu-plates on which Cu or Ni or Ni+Au plating was deposited, and solders (Sn-Pb solders or Sn-Ag-Cu solders), specimens of solder joints were fabricated. After aging it in an isothermal chamber, tensile tests were performed and the relationships between solder joint strength and aging period were considered. From SEM microscope observation and EDX microprobe analysis, the growth and components of the intermetallic compounds layer were examined. To investigate the stress condition on the solder joint interface, the finite element analysis was also carried out.
| Original language | English |
|---|---|
| Title of host publication | Advances in Electronic Materials and Packaging 2001 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 8-14 |
| Number of pages | 7 |
| ISBN (Print) | 0780371577, 9780780371576 |
| DOIs | |
| Publication status | Published - 2001 |
| Externally published | Yes |
| Event | 3rd International Symposium on Electronic Materials and Packaging, EMAP 2001 - Jeju Island, Korea, Republic of Duration: 2001 Nov 19 → 2001 Nov 22 |
Other
| Other | 3rd International Symposium on Electronic Materials and Packaging, EMAP 2001 |
|---|---|
| Country/Territory | Korea, Republic of |
| City | Jeju Island |
| Period | 01/11/19 → 01/11/22 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials