A mechanical reliability assessment of solder joints

K. Kishimoto, Masaki Omiya, M. Amagai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)


A mechanical reliability of the solder joints is a serious concern. Intermetallic compounds are formed during reflow process between solder and electrical pads and gradually grow in service. Due to it's brittle manner, the reliability of solder joints are supposed to degenerate. By using the Cu-plates on which Cu or Ni or Ni+Au plating was deposited, and solders (Sn-Pb solders or Sn-Ag-Cu solders), specimens of solder joints were fabricated. After aging it in an isothermal chamber, tensile tests were performed and the relationships between solder joint strength and aging period were considered. From SEM microscope observation and EDX microprobe analysis, the growth and components of the intermetallic compounds layer were examined. To investigate the stress condition on the solder joint interface, the finite element analysis was also carried out.

Original languageEnglish
Title of host publicationAdvances in Electronic Materials and Packaging 2001
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages7
ISBN (Print)0780371577, 9780780371576
Publication statusPublished - 2001
Externally publishedYes
Event3rd International Symposium on Electronic Materials and Packaging, EMAP 2001 - Jeju Island, Korea, Republic of
Duration: 2001 Nov 192001 Nov 22


Other3rd International Symposium on Electronic Materials and Packaging, EMAP 2001
Country/TerritoryKorea, Republic of
CityJeju Island

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials


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