TY - JOUR
T1 - A module-based thermal design approach for distributed product development
AU - Seki, Kenichi
AU - Nishimura, Hidekazu
N1 - Funding Information:
Acknowledgments This work was supported in part by a Grant-in-Aid from the Global Center of Excellence Program for the ‘‘Center for Education and Research of Symbiotic, Safe, and Secure System Design’’ from the Ministry of Education, Culture, Sport, and Technology in Japan. We also gratefully acknowledge the assistance of Prof. Kos Ishii, Stanford University. Prof. Ishii reviewed the initial manuscript of this paper and decided to submit it to Research in Engineering Design, but unfortunately, he passed away before the actual submission. We are thankful to Prof. Ishii for his advice and unconventional and inclusive way of thinking for design research. We would also like to thank Dr. Laurent Balmelli of IBM Software Group for his kind help and instruction. We also acknowledge Dr. Sun Kim and the Manufacturing Modeling Laboratory at Stanford University for their continuous support and discussions in this research.
PY - 2011/10
Y1 - 2011/10
N2 - Today, market demand for smaller, more powerful consumer electronics is rapidly posing a major challenge to product design. Several issues have been identified as major factors that affect the quality, cost, and delivery of product design in the so-called distributed design project. To address these concerns, a structured design method is needed. This paper proposes a design framework that can moderate inconsistent performance of system components (modules) resulting from a lack of communication between design sites. Module interconnection parameters at a system level are determined using the behavior-coupling matrix and work distribution matrix; initial design target values (ITVs) for system boundary conditions are provided for each module design. Our results show that system decomposition using ITVs offers a suitable framework for designing a product, considering the overall system behavior where each module is independently designed at different locations.
AB - Today, market demand for smaller, more powerful consumer electronics is rapidly posing a major challenge to product design. Several issues have been identified as major factors that affect the quality, cost, and delivery of product design in the so-called distributed design project. To address these concerns, a structured design method is needed. This paper proposes a design framework that can moderate inconsistent performance of system components (modules) resulting from a lack of communication between design sites. Module interconnection parameters at a system level are determined using the behavior-coupling matrix and work distribution matrix; initial design target values (ITVs) for system boundary conditions are provided for each module design. Our results show that system decomposition using ITVs offers a suitable framework for designing a product, considering the overall system behavior where each module is independently designed at different locations.
KW - Consumer electronics
KW - Design structure matrix
KW - Global engineering
KW - Multiple-domain matrix
KW - Product development process
KW - Thermal design
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U2 - 10.1007/s00163-011-0113-x
DO - 10.1007/s00163-011-0113-x
M3 - Article
AN - SCOPUS:80054904033
SN - 0934-9839
VL - 22
SP - 279
EP - 295
JO - Research in Engineering Design - Theory, Applications, and Concurrent Engineering
JF - Research in Engineering Design - Theory, Applications, and Concurrent Engineering
IS - 4
ER -