A module-based thermal design approach for distributed product development

Kenichi Seki, Hidekazu Nishimura

Research output: Contribution to journalArticle

14 Citations (Scopus)

Abstract

Today, market demand for smaller, more powerful consumer electronics is rapidly posing a major challenge to product design. Several issues have been identified as major factors that affect the quality, cost, and delivery of product design in the so-called distributed design project. To address these concerns, a structured design method is needed. This paper proposes a design framework that can moderate inconsistent performance of system components (modules) resulting from a lack of communication between design sites. Module interconnection parameters at a system level are determined using the behavior-coupling matrix and work distribution matrix; initial design target values (ITVs) for system boundary conditions are provided for each module design. Our results show that system decomposition using ITVs offers a suitable framework for designing a product, considering the overall system behavior where each module is independently designed at different locations.

Original languageEnglish
Pages (from-to)279-295
Number of pages17
JournalResearch in Engineering Design
Volume22
Issue number4
DOIs
Publication statusPublished - 2011 Oct

Fingerprint

Product development
Product design
Consumer electronics
Hot Temperature
Boundary conditions
Decomposition
Communication
Costs

Keywords

  • Consumer electronics
  • Design structure matrix
  • Global engineering
  • Multiple-domain matrix
  • Product development process
  • Thermal design

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Civil and Structural Engineering
  • Mechanical Engineering
  • Architecture

Cite this

A module-based thermal design approach for distributed product development. / Seki, Kenichi; Nishimura, Hidekazu.

In: Research in Engineering Design, Vol. 22, No. 4, 10.2011, p. 279-295.

Research output: Contribution to journalArticle

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