A module design approach using structural and functional modeling for distributed consumer electronics design project

Kenichi Seki, Hidekazu Nishimura, Shaopeng Zhu, Laurent Balmelli

Research output: Contribution to journalArticle

Abstract

This paper describes the utilization of the product model by SysML as a joint platform for distributed design. We introduce a typical design process involving distributed design teams. In particular, this process allows a thermal design of cavities, i.e., air space inside the enclosure, in terms of flow rate, acoustic radiation resistance and so on. Then, we investigate a module-based design optimization approach defining cavity as a module to efficiently support such processes. Authors propose structural and functional modeling that enables all the distributed design sites to share the design information with the product model. Using this design framework, it will be possible to prevent performance defects due to physical coupling between modules, and thus, reduce the iteration of work.

Original languageEnglish
Pages (from-to)187-200
Number of pages14
JournalNihon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C
Volume78
Issue number785
DOIs
Publication statusPublished - 2012
Externally publishedYes

Fingerprint

Consumer electronics
Enclosures
Acoustics
Flow rate
Radiation
Defects
Air

Keywords

  • Consumer electronics
  • Design structure matrix
  • Global engineering
  • Product development process
  • Simulation
  • SysML
  • Thermal design

ASJC Scopus subject areas

  • Mechanical Engineering
  • Mechanics of Materials
  • Industrial and Manufacturing Engineering

Cite this

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