A new specimen for measuring the interfacial toughness of Al-0.5%Cu thin film on Si substrate

I. Jeon; M. Omiya; H. Inoue; K. Kishimoto; T. Asahina

doi:10.4028/0-87849-978-4.521

A new specimen for measuring the interfacial toughness of Al-0.5%Cu thin film on Si substrate

I. Jeon, M. Omiya, H. Inoue, K. Kishimoto, T. Asahina

Research output: Contribution to journal › Article › peer-review

Abstract

A new specimen is proposed to measure the interfacial toughness between the Al-0.5%Cu thin film and the Si substrate. The plain and general micro-fabrication processes are sufficient to fabricate the specimen. With the help of the finite element method and the concepts of the linear elastic fracture mechanics, the detailed structure for this specimen is modeled and evaluated. The results obtained from this research show that the proposed specimen provides efficient and convenient method to measure the interfacial toughness between the Al-Cu thin film and the Si substrate.

Original language	English
Pages (from-to)	521-526
Number of pages	6
Journal	Key Engineering Materials
Volume	297-300 I
DOIs	https://doi.org/10.4028/0-87849-978-4.521
Publication status	Published - 2005 Jan 1
Externally published	Yes

Keywords

Al-0.5%Cu thin film
Indentation
Interfacial toughness
New specimen

ASJC Scopus subject areas

Materials Science(all)
Mechanics of Materials
Mechanical Engineering

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10.4028/0-87849-978-4.521

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abstract = "A new specimen is proposed to measure the interfacial toughness between the Al-0.5%Cu thin film and the Si substrate. The plain and general micro-fabrication processes are sufficient to fabricate the specimen. With the help of the finite element method and the concepts of the linear elastic fracture mechanics, the detailed structure for this specimen is modeled and evaluated. The results obtained from this research show that the proposed specimen provides efficient and convenient method to measure the interfacial toughness between the Al-Cu thin film and the Si substrate.",

keywords = "Al-0.5%Cu thin film, Indentation, Interfacial toughness, New specimen",

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T1 - A new specimen for measuring the interfacial toughness of Al-0.5%Cu thin film on Si substrate

AU - Jeon, I.

AU - Omiya, M.

AU - Inoue, H.

AU - Kishimoto, K.

AU - Asahina, T.

PY - 2005/1/1

Y1 - 2005/1/1

N2 - A new specimen is proposed to measure the interfacial toughness between the Al-0.5%Cu thin film and the Si substrate. The plain and general micro-fabrication processes are sufficient to fabricate the specimen. With the help of the finite element method and the concepts of the linear elastic fracture mechanics, the detailed structure for this specimen is modeled and evaluated. The results obtained from this research show that the proposed specimen provides efficient and convenient method to measure the interfacial toughness between the Al-Cu thin film and the Si substrate.

AB - A new specimen is proposed to measure the interfacial toughness between the Al-0.5%Cu thin film and the Si substrate. The plain and general micro-fabrication processes are sufficient to fabricate the specimen. With the help of the finite element method and the concepts of the linear elastic fracture mechanics, the detailed structure for this specimen is modeled and evaluated. The results obtained from this research show that the proposed specimen provides efficient and convenient method to measure the interfacial toughness between the Al-Cu thin film and the Si substrate.

KW - Al-0.5%Cu thin film

KW - Indentation

KW - Interfacial toughness

KW - New specimen

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A new specimen for measuring the interfacial toughness of Al-0.5%Cu thin film on Si substrate

Abstract

Keywords

ASJC Scopus subject areas

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