A new specimen for measuring the interfacial toughness of Al-0.5%Cu thin film on Si substrate

I. Jeon, M. Omiya, H. Inoue, K. Kishimoto, T. Asahina

Research output: Contribution to journalArticle

Abstract

A new specimen is proposed to measure the interfacial toughness between the Al-0.5%Cu thin film and the Si substrate. The plain and general micro-fabrication processes are sufficient to fabricate the specimen. With the help of the finite element method and the concepts of the linear elastic fracture mechanics, the detailed structure for this specimen is modeled and evaluated. The results obtained from this research show that the proposed specimen provides efficient and convenient method to measure the interfacial toughness between the Al-Cu thin film and the Si substrate.

Original languageEnglish
Pages (from-to)521-526
Number of pages6
JournalKey Engineering Materials
Volume297-300 I
DOIs
Publication statusPublished - 2005 Jan 1

Keywords

  • Al-0.5%Cu thin film
  • Indentation
  • Interfacial toughness
  • New specimen

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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