A new specimen for measuring the interfacial toughness of Al-0.5%Cu thin film on Si substrate

I. Jeon, Masaki Omiya, H. Inoue, K. Kishimoto, T. Asahina

Research output: Contribution to journalArticle

Abstract

A new specimen is proposed to measure the interfacial toughness between the Al-0.5%Cu thin film and the Si substrate. The plain and general micro-fabrication processes are sufficient to fabricate the specimen. With the help of the finite element method and the concepts of the linear elastic fracture mechanics, the detailed structure for this specimen is modeled and evaluated. The results obtained from this research show that the proposed specimen provides efficient and convenient method to measure the interfacial toughness between the Al-Cu thin film and the Si substrate.

Original languageEnglish
Pages (from-to)521-526
Number of pages6
JournalKey Engineering Materials
Volume297-300 I
Publication statusPublished - 2005
Externally publishedYes

Fingerprint

Toughness
Thin films
Microfabrication
Substrates
Fracture mechanics
Finite element method

Keywords

  • Al-0.5%Cu thin film
  • Indentation
  • Interfacial toughness
  • New specimen

ASJC Scopus subject areas

  • Ceramics and Composites
  • Chemical Engineering (miscellaneous)

Cite this

A new specimen for measuring the interfacial toughness of Al-0.5%Cu thin film on Si substrate. / Jeon, I.; Omiya, Masaki; Inoue, H.; Kishimoto, K.; Asahina, T.

In: Key Engineering Materials, Vol. 297-300 I, 2005, p. 521-526.

Research output: Contribution to journalArticle

Jeon, I. ; Omiya, Masaki ; Inoue, H. ; Kishimoto, K. ; Asahina, T. / A new specimen for measuring the interfacial toughness of Al-0.5%Cu thin film on Si substrate. In: Key Engineering Materials. 2005 ; Vol. 297-300 I. pp. 521-526.
@article{924dfb14e2024195bdb528434a64ec18,
title = "A new specimen for measuring the interfacial toughness of Al-0.5{\%}Cu thin film on Si substrate",
abstract = "A new specimen is proposed to measure the interfacial toughness between the Al-0.5{\%}Cu thin film and the Si substrate. The plain and general micro-fabrication processes are sufficient to fabricate the specimen. With the help of the finite element method and the concepts of the linear elastic fracture mechanics, the detailed structure for this specimen is modeled and evaluated. The results obtained from this research show that the proposed specimen provides efficient and convenient method to measure the interfacial toughness between the Al-Cu thin film and the Si substrate.",
keywords = "Al-0.5{\%}Cu thin film, Indentation, Interfacial toughness, New specimen",
author = "I. Jeon and Masaki Omiya and H. Inoue and K. Kishimoto and T. Asahina",
year = "2005",
language = "English",
volume = "297-300 I",
pages = "521--526",
journal = "Key Engineering Materials",
issn = "1013-9826",
publisher = "Trans Tech Publications",

}

TY - JOUR

T1 - A new specimen for measuring the interfacial toughness of Al-0.5%Cu thin film on Si substrate

AU - Jeon, I.

AU - Omiya, Masaki

AU - Inoue, H.

AU - Kishimoto, K.

AU - Asahina, T.

PY - 2005

Y1 - 2005

N2 - A new specimen is proposed to measure the interfacial toughness between the Al-0.5%Cu thin film and the Si substrate. The plain and general micro-fabrication processes are sufficient to fabricate the specimen. With the help of the finite element method and the concepts of the linear elastic fracture mechanics, the detailed structure for this specimen is modeled and evaluated. The results obtained from this research show that the proposed specimen provides efficient and convenient method to measure the interfacial toughness between the Al-Cu thin film and the Si substrate.

AB - A new specimen is proposed to measure the interfacial toughness between the Al-0.5%Cu thin film and the Si substrate. The plain and general micro-fabrication processes are sufficient to fabricate the specimen. With the help of the finite element method and the concepts of the linear elastic fracture mechanics, the detailed structure for this specimen is modeled and evaluated. The results obtained from this research show that the proposed specimen provides efficient and convenient method to measure the interfacial toughness between the Al-Cu thin film and the Si substrate.

KW - Al-0.5%Cu thin film

KW - Indentation

KW - Interfacial toughness

KW - New specimen

UR - http://www.scopus.com/inward/record.url?scp=34249711813&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=34249711813&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:34249711813

VL - 297-300 I

SP - 521

EP - 526

JO - Key Engineering Materials

JF - Key Engineering Materials

SN - 1013-9826

ER -