A parametric design framework to support structural and functional modeling of complex consumer electronics products

Kenichi Seki, Hidekazu Nishimura, Shaopeng Zhu, Laurent Balmelli

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

Today's market demand for smaller and more powerful consumer electronic devices poses a major challenge to the rapid design of products. In addition, the ability to perform strategic coordination among different stakeholders within the enterprise increasingly becomes an important criterion for global engineering. In this study, we first introduce a typical design process involving distributed design teams. In particular, this process allows a thermal-acoustic design of cavities, i.e., air space inside the enclosure, in terms of flow rate and acoustic radiation resistance. Then, we investigate a module-based design optimization approach defining cavity as a module to efficiently support such processes. We ensure the design control of both cavity characteristics in an internationally distributed project through design data analysis using the Systems Modeling Language (SysML) and the resulting product model descriptions of the system architecture.

Original languageEnglish
Title of host publicationICED 11 - 18th International Conference on Engineering Design - Impacting Society Through Engineering Design
Pages282-291
Number of pages10
Volume6
Publication statusPublished - 2011
Event18th International Conference on Engineering Design, ICED 11 - Copenhagen, Denmark
Duration: 2011 Aug 152011 Aug 18

Other

Other18th International Conference on Engineering Design, ICED 11
CountryDenmark
CityCopenhagen
Period11/8/1511/8/18

Fingerprint

Consumer electronics
Acoustics
Enclosures
Flow rate
Radiation
Air
Industry

Keywords

  • Consumer Electronics
  • Global Engineering
  • Product Model
  • Simulation
  • SysML

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering

Cite this

Seki, K., Nishimura, H., Zhu, S., & Balmelli, L. (2011). A parametric design framework to support structural and functional modeling of complex consumer electronics products. In ICED 11 - 18th International Conference on Engineering Design - Impacting Society Through Engineering Design (Vol. 6, pp. 282-291)

A parametric design framework to support structural and functional modeling of complex consumer electronics products. / Seki, Kenichi; Nishimura, Hidekazu; Zhu, Shaopeng; Balmelli, Laurent.

ICED 11 - 18th International Conference on Engineering Design - Impacting Society Through Engineering Design. Vol. 6 2011. p. 282-291.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Seki, K, Nishimura, H, Zhu, S & Balmelli, L 2011, A parametric design framework to support structural and functional modeling of complex consumer electronics products. in ICED 11 - 18th International Conference on Engineering Design - Impacting Society Through Engineering Design. vol. 6, pp. 282-291, 18th International Conference on Engineering Design, ICED 11, Copenhagen, Denmark, 11/8/15.
Seki K, Nishimura H, Zhu S, Balmelli L. A parametric design framework to support structural and functional modeling of complex consumer electronics products. In ICED 11 - 18th International Conference on Engineering Design - Impacting Society Through Engineering Design. Vol. 6. 2011. p. 282-291
Seki, Kenichi ; Nishimura, Hidekazu ; Zhu, Shaopeng ; Balmelli, Laurent. / A parametric design framework to support structural and functional modeling of complex consumer electronics products. ICED 11 - 18th International Conference on Engineering Design - Impacting Society Through Engineering Design. Vol. 6 2011. pp. 282-291
@inproceedings{44ab39ed21974a0a95daf93a4b053618,
title = "A parametric design framework to support structural and functional modeling of complex consumer electronics products",
abstract = "Today's market demand for smaller and more powerful consumer electronic devices poses a major challenge to the rapid design of products. In addition, the ability to perform strategic coordination among different stakeholders within the enterprise increasingly becomes an important criterion for global engineering. In this study, we first introduce a typical design process involving distributed design teams. In particular, this process allows a thermal-acoustic design of cavities, i.e., air space inside the enclosure, in terms of flow rate and acoustic radiation resistance. Then, we investigate a module-based design optimization approach defining cavity as a module to efficiently support such processes. We ensure the design control of both cavity characteristics in an internationally distributed project through design data analysis using the Systems Modeling Language (SysML) and the resulting product model descriptions of the system architecture.",
keywords = "Consumer Electronics, Global Engineering, Product Model, Simulation, SysML",
author = "Kenichi Seki and Hidekazu Nishimura and Shaopeng Zhu and Laurent Balmelli",
year = "2011",
language = "English",
isbn = "9781904670261",
volume = "6",
pages = "282--291",
booktitle = "ICED 11 - 18th International Conference on Engineering Design - Impacting Society Through Engineering Design",

}

TY - GEN

T1 - A parametric design framework to support structural and functional modeling of complex consumer electronics products

AU - Seki, Kenichi

AU - Nishimura, Hidekazu

AU - Zhu, Shaopeng

AU - Balmelli, Laurent

PY - 2011

Y1 - 2011

N2 - Today's market demand for smaller and more powerful consumer electronic devices poses a major challenge to the rapid design of products. In addition, the ability to perform strategic coordination among different stakeholders within the enterprise increasingly becomes an important criterion for global engineering. In this study, we first introduce a typical design process involving distributed design teams. In particular, this process allows a thermal-acoustic design of cavities, i.e., air space inside the enclosure, in terms of flow rate and acoustic radiation resistance. Then, we investigate a module-based design optimization approach defining cavity as a module to efficiently support such processes. We ensure the design control of both cavity characteristics in an internationally distributed project through design data analysis using the Systems Modeling Language (SysML) and the resulting product model descriptions of the system architecture.

AB - Today's market demand for smaller and more powerful consumer electronic devices poses a major challenge to the rapid design of products. In addition, the ability to perform strategic coordination among different stakeholders within the enterprise increasingly becomes an important criterion for global engineering. In this study, we first introduce a typical design process involving distributed design teams. In particular, this process allows a thermal-acoustic design of cavities, i.e., air space inside the enclosure, in terms of flow rate and acoustic radiation resistance. Then, we investigate a module-based design optimization approach defining cavity as a module to efficiently support such processes. We ensure the design control of both cavity characteristics in an internationally distributed project through design data analysis using the Systems Modeling Language (SysML) and the resulting product model descriptions of the system architecture.

KW - Consumer Electronics

KW - Global Engineering

KW - Product Model

KW - Simulation

KW - SysML

UR - http://www.scopus.com/inward/record.url?scp=84858847972&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84858847972&partnerID=8YFLogxK

M3 - Conference contribution

SN - 9781904670261

VL - 6

SP - 282

EP - 291

BT - ICED 11 - 18th International Conference on Engineering Design - Impacting Society Through Engineering Design

ER -