A Practical Collision Avoidance Method for an Inter-Chip Bus with Wireless Inductive through Chip Interface

Akio Nomura, Jun'Ichiro Kadomoto, Tadahiro Kuroda, Hideharu Amano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

One of the benefits of wireless inductive through chip interface is that it allows to build a shared bus just by placing a coil on the same location in each chip. Since providing dedicated channels for arbitration is expensive, carrier sense multiple access with collision detection (CSMA/CD) is hopeful as the bus control method. Here, a rotationpersistent collision avoidance algorithm dedicated for the wireless inter-chip bus is proposed. In the method, after the carrier sense, only a specific chip can instantly send the data, and others must wait for a random time interval. It improved the throughput of 1-persistent CSMA/CD by 33% on average.

Original languageEnglish
Title of host publicationProceedings - 2017 5th International Symposium on Computing and Networking, CANDAR 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages126-131
Number of pages6
Volume2018-January
ISBN (Electronic)9781538620878
DOIs
Publication statusPublished - 2018 Apr 23
Event5th International Symposium on Computing and Networking, CANDAR 2017 - Aomori, Japan
Duration: 2017 Nov 192017 Nov 22

Other

Other5th International Symposium on Computing and Networking, CANDAR 2017
CountryJapan
CityAomori
Period17/11/1917/11/22

Keywords

  • collision avoidance method
  • Inductive coupling through chip interface
  • shared bus

ASJC Scopus subject areas

  • Artificial Intelligence
  • Computer Networks and Communications
  • Hardware and Architecture

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  • Cite this

    Nomura, A., Kadomoto, JI., Kuroda, T., & Amano, H. (2018). A Practical Collision Avoidance Method for an Inter-Chip Bus with Wireless Inductive through Chip Interface. In Proceedings - 2017 5th International Symposium on Computing and Networking, CANDAR 2017 (Vol. 2018-January, pp. 126-131). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CANDAR.2017.15