A study of multi-stack silicon-direct wafer bonding for MEMS manufacturing

Norihisa Miki, X. Zhang, R. Khanna, A. A. Ayón, D. Ward, S. M. Spearing

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

Multi-stack wafer bonding is one of the most promising fabrication techniques for creating three-dimensional microstructures, such as for power MEMS devices. However, there are several bonding issues that MEMS technologists have to face and overcome to successfully build multilayered structures. Among these are: (1) Chemical residues on surfaces to be bonded originating from the fabrication processes prior to bonding, (2) Increased stiffness due to multiple bonded wafers and/or thick wafers, (3) Bonding tool effects, and (4) Defect propagation to other wafer levels after high-temperature annealing cycles. The problems and the solutions presented here are readily applicable to any MEMS project involving the fabrication of multi-stack structures of two or more wafers containing intricate geometries and large etched areas.

Original languageEnglish
Title of host publicationProceedings of the IEEE Micro Electro Mechanical Systems (MEMS)
Pages407-410
Number of pages4
Publication statusPublished - 2002
Externally publishedYes
Event15th IEEE International Conference on Micro Electro Mechanical Systems MEMS 2002 - Las Vegas, NV, United States
Duration: 2002 Jan 202002 Jan 24

Other

Other15th IEEE International Conference on Micro Electro Mechanical Systems MEMS 2002
CountryUnited States
CityLas Vegas, NV
Period02/1/2002/1/24

Fingerprint

Wafer bonding
MEMS
Fabrication
Silicon
Stiffness
Annealing
Defects
Microstructure
Geometry
Temperature

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

Miki, N., Zhang, X., Khanna, R., Ayón, A. A., Ward, D., & Spearing, S. M. (2002). A study of multi-stack silicon-direct wafer bonding for MEMS manufacturing. In Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS) (pp. 407-410)

A study of multi-stack silicon-direct wafer bonding for MEMS manufacturing. / Miki, Norihisa; Zhang, X.; Khanna, R.; Ayón, A. A.; Ward, D.; Spearing, S. M.

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS). 2002. p. 407-410.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Miki, N, Zhang, X, Khanna, R, Ayón, AA, Ward, D & Spearing, SM 2002, A study of multi-stack silicon-direct wafer bonding for MEMS manufacturing. in Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS). pp. 407-410, 15th IEEE International Conference on Micro Electro Mechanical Systems MEMS 2002, Las Vegas, NV, United States, 02/1/20.
Miki N, Zhang X, Khanna R, Ayón AA, Ward D, Spearing SM. A study of multi-stack silicon-direct wafer bonding for MEMS manufacturing. In Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS). 2002. p. 407-410
Miki, Norihisa ; Zhang, X. ; Khanna, R. ; Ayón, A. A. ; Ward, D. ; Spearing, S. M. / A study of multi-stack silicon-direct wafer bonding for MEMS manufacturing. Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS). 2002. pp. 407-410
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