Abstract
ThruChip interface (TCI) is an emerging wireless interface in three-dimensional (3-D) integrated circuit (IC) technology. However, the TCI physical design guidelines remain unclear. In this paper, a ThruChip test chip is designed and fabricated for design guidelines exploration. Three inductive coupling interface physical design scenarios, baseline, power mesh, and dummy metal fill, are deployed in the test chip. In the baseline scenario, the test chip measurement results show that thinning chip or enlarging coil dimension can further reduce TCI power. The power mesh scenario shows that the eddy current on power mesh can dramatically reduce magnetic pulse signal and thus possibly cause TCI to fail. A power mesh splitting method is proposed to effectively suppress eddy current impact while minimizing power mesh structure impact. The simulation results show that the proposed method can recover 77% coupling coefficient loss while only introducing additional 0.5% IR-drop. In dummy metal fill case, dummy metal fill enclosed within TCI coils have no impact on TCI transmission and thus are ignorable.
| Original language | English |
|---|---|
| Pages (from-to) | 2584-2591 |
| Number of pages | 8 |
| Journal | IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences |
| Volume | E98A |
| Issue number | 12 |
| DOIs | |
| Publication status | Published - 2015 Dec 1 |
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Keywords
- 3-D IC
- Inductive coupling interface
- TCI
- ThruChip
- Tsv
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Computer Graphics and Computer-Aided Design
- Applied Mathematics
- Signal Processing
Cite this
A study of physical design guidelines in thruchip inductive coupling channel. / Hsu, Li Chung; Kadomoto, Junichiro; Hasegawa, So; Kosuge, Atsutake; Take, Yasuhiro; Kuroda, Tadahiro.
In: IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences, Vol. E98A, No. 12, 01.12.2015, p. 2584-2591.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - A study of physical design guidelines in thruchip inductive coupling channel
AU - Hsu, Li Chung
AU - Kadomoto, Junichiro
AU - Hasegawa, So
AU - Kosuge, Atsutake
AU - Take, Yasuhiro
AU - Kuroda, Tadahiro
PY - 2015/12/1
Y1 - 2015/12/1
N2 - ThruChip interface (TCI) is an emerging wireless interface in three-dimensional (3-D) integrated circuit (IC) technology. However, the TCI physical design guidelines remain unclear. In this paper, a ThruChip test chip is designed and fabricated for design guidelines exploration. Three inductive coupling interface physical design scenarios, baseline, power mesh, and dummy metal fill, are deployed in the test chip. In the baseline scenario, the test chip measurement results show that thinning chip or enlarging coil dimension can further reduce TCI power. The power mesh scenario shows that the eddy current on power mesh can dramatically reduce magnetic pulse signal and thus possibly cause TCI to fail. A power mesh splitting method is proposed to effectively suppress eddy current impact while minimizing power mesh structure impact. The simulation results show that the proposed method can recover 77% coupling coefficient loss while only introducing additional 0.5% IR-drop. In dummy metal fill case, dummy metal fill enclosed within TCI coils have no impact on TCI transmission and thus are ignorable.
AB - ThruChip interface (TCI) is an emerging wireless interface in three-dimensional (3-D) integrated circuit (IC) technology. However, the TCI physical design guidelines remain unclear. In this paper, a ThruChip test chip is designed and fabricated for design guidelines exploration. Three inductive coupling interface physical design scenarios, baseline, power mesh, and dummy metal fill, are deployed in the test chip. In the baseline scenario, the test chip measurement results show that thinning chip or enlarging coil dimension can further reduce TCI power. The power mesh scenario shows that the eddy current on power mesh can dramatically reduce magnetic pulse signal and thus possibly cause TCI to fail. A power mesh splitting method is proposed to effectively suppress eddy current impact while minimizing power mesh structure impact. The simulation results show that the proposed method can recover 77% coupling coefficient loss while only introducing additional 0.5% IR-drop. In dummy metal fill case, dummy metal fill enclosed within TCI coils have no impact on TCI transmission and thus are ignorable.
KW - 3-D IC
KW - Inductive coupling interface
KW - TCI
KW - ThruChip
KW - Tsv
UR - http://www.scopus.com/inward/record.url?scp=84948650016&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84948650016&partnerID=8YFLogxK
U2 - 10.1587/transfun.E98.A.2584
DO - 10.1587/transfun.E98.A.2584
M3 - Article
AN - SCOPUS:84948650016
VL - E98A
SP - 2584
EP - 2591
JO - IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences
JF - IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences
SN - 0916-8508
IS - 12
ER -