A system-level thermal design specification development of electronic products considering software changes

Yoshio Muraoka, Kenichi Seki, Hidekazu Nishimura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Realizing the market demand for small size and fast processing speeds, thermal design is one of the major challenges in the development of electronic products. In addition, there are many software changes necessary to adapt to the rapid-moving trends in customer applications. Therefore it is difficult to develop a product design specification in the early stages of product development. In this study, we first introduce a typical system-level thermal design simulation method, coupling activities among modules related to software, electrical parts, and mechanical structure. In particular, this method allows us to evaluate risks related to thermal burn injury depending on the software's application. Then, we investigate this method by applying it to a design process case for electronic products that require software changes, such as having additional applications. The system-level simulation can be used to evaluate the thermal risk that may rise by the applications. We verify the design control to satisfy product quality using Systems Modeling Language (SysML) and the resulting design specification of the system architecture.

Original languageEnglish
Title of host publicationProceedings of the International Conference on Engineering Design, ICED
Pages319-328
Number of pages10
Volume1 DS75-01
Publication statusPublished - 2013
Event19th International Conference on Engineering Design, ICED 2013 - Seoul, Korea, Republic of
Duration: 2013 Aug 192013 Aug 22

Other

Other19th International Conference on Engineering Design, ICED 2013
CountryKorea, Republic of
CitySeoul
Period13/8/1913/8/22

Fingerprint

Electronics
Specification
Specifications
Software
Evaluate
Product Design
Product Development
Modeling Language
System Architecture
Control Design
System Modeling
Simulation Methods
Design Process
Design Method
Product design
Application programs
Customers
Product development
Verify
Module

Keywords

  • Collaborative design
  • Electronic products
  • Low-temperature burn injury
  • Simulation
  • Software change
  • SysML
  • Thermal design

ASJC Scopus subject areas

  • Engineering (miscellaneous)
  • Industrial and Manufacturing Engineering
  • Modelling and Simulation

Cite this

Muraoka, Y., Seki, K., & Nishimura, H. (2013). A system-level thermal design specification development of electronic products considering software changes. In Proceedings of the International Conference on Engineering Design, ICED (Vol. 1 DS75-01, pp. 319-328)

A system-level thermal design specification development of electronic products considering software changes. / Muraoka, Yoshio; Seki, Kenichi; Nishimura, Hidekazu.

Proceedings of the International Conference on Engineering Design, ICED. Vol. 1 DS75-01 2013. p. 319-328.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Muraoka, Y, Seki, K & Nishimura, H 2013, A system-level thermal design specification development of electronic products considering software changes. in Proceedings of the International Conference on Engineering Design, ICED. vol. 1 DS75-01, pp. 319-328, 19th International Conference on Engineering Design, ICED 2013, Seoul, Korea, Republic of, 13/8/19.
Muraoka Y, Seki K, Nishimura H. A system-level thermal design specification development of electronic products considering software changes. In Proceedings of the International Conference on Engineering Design, ICED. Vol. 1 DS75-01. 2013. p. 319-328
Muraoka, Yoshio ; Seki, Kenichi ; Nishimura, Hidekazu. / A system-level thermal design specification development of electronic products considering software changes. Proceedings of the International Conference on Engineering Design, ICED. Vol. 1 DS75-01 2013. pp. 319-328
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