A temperature-compensated CMOS LC-VCO enabling the direct modulation architecture in 2.4GHz GFSK transmitter

T. Tanzawa, H. Shibayama, R. Terauchi, K. Hisano, H. Ishikuro, S. Kousai, H. Kobayashi, H. Majima, T. Takayama, K. Agawa, M. Koizumi, F. Hatori

Research output: Contribution to journalConference articlepeer-review

9 Citations (Scopus)

Abstract

The frequency drift of open-loop PLL is an issue for the direct modulation applications such as Bluetooth transceiver. The drift mainly comes from the temperature variation of the VCO during the TX operation. In this paper, we propose the optimum location of the VCO considering the temperature gradient through the full-chip thermal analysis. Moreover, a novel temperature- compensated VCO by employing a new biasing scheme is proposed. The combination of these two techniques enables the power reduction of the transmitter by 33% without sacrificing the performance.

Original languageEnglish
Pages (from-to)273-276
Number of pages4
JournalProceedings of the Custom Integrated Circuits Conference
Publication statusPublished - 2004 Dec 1
Externally publishedYes
EventProceedings of the IEEE 2004 Custom Integrated Circuits Conference, CICC - Orlando, FL, United States
Duration: 2004 Oct 32004 Oct 6

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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