A trial for micro-scale evaluation of adhesion strength around Cu metallization systems

Shoji Kamiya, Hitoshi Arakawa, Hiroshi Shimomura, Masaki Omiya

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Adhesion strength of the interface between Cu film and SiCN cap layer for IC metallization system was evaluated by a technique developed by the authors. In this technique, microscopic specimens with the in-plane dimension less than 10 μm were fabricated by focused ion beam system and loaded directly by a sharp diamond stylus with submicron tip radius. By comparing the crack extension behavior with the three-dimensional numerical simulation, the interface adhesion energy was evaluated to be 5 J/m2. The same interface was subjected also to the four-point bending experiment, which is widely applied to interface adhesion measurement. The evaluation results by the two techniques agreed reasonably well with each other.

Original languageEnglish
Title of host publicationMaterials Research Society Symposium Proceedings
Pages213-218
Number of pages6
Volume990
Publication statusPublished - 2007
Event2007 MRS Spring Meeting - San Francisco, CA, United States
Duration: 2007 Apr 102007 Apr 12

Other

Other2007 MRS Spring Meeting
CountryUnited States
CitySan Francisco, CA
Period07/4/1007/4/12

Fingerprint

Bond strength (materials)
Metallizing
Adhesion
Diamond
Focused ion beams
Interfaces (computer)
Diamonds
Cracks
Computer simulation
Experiments

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Kamiya, S., Arakawa, H., Shimomura, H., & Omiya, M. (2007). A trial for micro-scale evaluation of adhesion strength around Cu metallization systems. In Materials Research Society Symposium Proceedings (Vol. 990, pp. 213-218)

A trial for micro-scale evaluation of adhesion strength around Cu metallization systems. / Kamiya, Shoji; Arakawa, Hitoshi; Shimomura, Hiroshi; Omiya, Masaki.

Materials Research Society Symposium Proceedings. Vol. 990 2007. p. 213-218.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kamiya, S, Arakawa, H, Shimomura, H & Omiya, M 2007, A trial for micro-scale evaluation of adhesion strength around Cu metallization systems. in Materials Research Society Symposium Proceedings. vol. 990, pp. 213-218, 2007 MRS Spring Meeting, San Francisco, CA, United States, 07/4/10.
Kamiya S, Arakawa H, Shimomura H, Omiya M. A trial for micro-scale evaluation of adhesion strength around Cu metallization systems. In Materials Research Society Symposium Proceedings. Vol. 990. 2007. p. 213-218
Kamiya, Shoji ; Arakawa, Hitoshi ; Shimomura, Hiroshi ; Omiya, Masaki. / A trial for micro-scale evaluation of adhesion strength around Cu metallization systems. Materials Research Society Symposium Proceedings. Vol. 990 2007. pp. 213-218
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