A vertical bubble flow network using inductive-coupling for 3-D CMPs

Hiroki Matsutani, Yasuhiro Take, Daisuke Sasaki, Masayuki Kimura, Yuki Ono, Yukinori Nishiyama, Michihiro Koibuchi, Tadahiro Kuroda, Hideharu Amano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

17 Citations (Scopus)

Abstract

A wireless 3-D NoC architecture for CMPs, in which the number of processor and cache chips stacked in a package can be changed after the chip fabrication, is proposed by using the inductive coupling technology that can connect more than two known-good-dies without wire connections. Each chip has data transceivers for uplink and downlink in order to communicate with its neighboring chips in the package. These chips form a single vertical ring network so as to fully exploit the flexibility of the wireless approach that enables us to add, remove, and swap the chips in the ring. To avoid protocol and structural deadlocks in the ring network, we use the bubble flow control which is more flexible and efficient compared to the conventional VC-based deadlock avoidance. We implemented a real 3-D chip that has on-chip routers and inductive-coupling data transceivers using a 65nm process in order to show the feasibility of our proposal. The vertical bubble flow control is compared with the conventional VC-based approach and vertical bus in terms of the throughput, hardware amount, and application performance using a full system CMP simulator. The results show that the proposed vertical bubble flow network outperforms the VC-based approach by 7.9%-12.5% with a 33.5% smaller router area.

Original languageEnglish
Title of host publicationNOCS 2011: The 5th ACM/IEEE International Symposium on Networks-on-Chip
Pages49-56
Number of pages8
DOIs
Publication statusPublished - 2011
Event5th ACM/IEEE International Symposium on Networks-on-Chip, NOCS 2011 - Pittsburgh, PA, United States
Duration: 2011 May 12011 May 4

Other

Other5th ACM/IEEE International Symposium on Networks-on-Chip, NOCS 2011
CountryUnited States
CityPittsburgh, PA
Period11/5/111/5/4

    Fingerprint

Keywords

  • 3-D ICs
  • inductive-coupling
  • many-core
  • on-chip networks

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Matsutani, H., Take, Y., Sasaki, D., Kimura, M., Ono, Y., Nishiyama, Y., ... Amano, H. (2011). A vertical bubble flow network using inductive-coupling for 3-D CMPs. In NOCS 2011: The 5th ACM/IEEE International Symposium on Networks-on-Chip (pp. 49-56) https://doi.org/10.1145/1999946.1999955