A wafer test method of inductive-coupling link

Kazutaka Kasuga, Mitsuko Saito, Tsutomu Takeya, Noriyuki Miura, Hiroki Ishikuro, Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

This paper provides the method for Wafer test of an inductive-coupling link. The inductive-coupling link can be tested whether it operates correctly before stacking chips. We provided the method that verify the operation of an inductive-coupling link from the relation between coupling coefficient of inductors and power that transmitter consumes.

Original languageEnglish
Title of host publicationProceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009
Pages301-304
Number of pages4
DOIs
Publication statusPublished - 2009
Event2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009 - Taipei, Taiwan, Province of China
Duration: 2009 Nov 162009 Nov 18

Other

Other2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009
CountryTaiwan, Province of China
CityTaipei
Period09/11/1609/11/18

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Transmitters

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Kasuga, K., Saito, M., Takeya, T., Miura, N., Ishikuro, H., & Kuroda, T. (2009). A wafer test method of inductive-coupling link. In Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009 (pp. 301-304). [5357251] https://doi.org/10.1109/ASSCC.2009.5357251

A wafer test method of inductive-coupling link. / Kasuga, Kazutaka; Saito, Mitsuko; Takeya, Tsutomu; Miura, Noriyuki; Ishikuro, Hiroki; Kuroda, Tadahiro.

Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009. 2009. p. 301-304 5357251.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kasuga, K, Saito, M, Takeya, T, Miura, N, Ishikuro, H & Kuroda, T 2009, A wafer test method of inductive-coupling link. in Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009., 5357251, pp. 301-304, 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009, Taipei, Taiwan, Province of China, 09/11/16. https://doi.org/10.1109/ASSCC.2009.5357251
Kasuga K, Saito M, Takeya T, Miura N, Ishikuro H, Kuroda T. A wafer test method of inductive-coupling link. In Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009. 2009. p. 301-304. 5357251 https://doi.org/10.1109/ASSCC.2009.5357251
Kasuga, Kazutaka ; Saito, Mitsuko ; Takeya, Tsutomu ; Miura, Noriyuki ; Ishikuro, Hiroki ; Kuroda, Tadahiro. / A wafer test method of inductive-coupling link. Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009. 2009. pp. 301-304
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