A wafer test method of inductive-coupling link

Kazutaka Kasuga, Mitsuko Saito, Tsutomu Takeya, Noriyuki Miura, Hiroki Ishikuro, Tadahiro Kuroda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    6 Citations (Scopus)

    Abstract

    This paper provides the method for Wafer test of an inductive-coupling link. The inductive-coupling link can be tested whether it operates correctly before stacking chips. We provided the method that verify the operation of an inductive-coupling link from the relation between coupling coefficient of inductors and power that transmitter consumes.

    Original languageEnglish
    Title of host publicationProceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009
    Pages301-304
    Number of pages4
    DOIs
    Publication statusPublished - 2009 Dec 1
    Event2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009 - Taipei, Taiwan, Province of China
    Duration: 2009 Nov 162009 Nov 18

    Publication series

    NameProceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009

    Conference

    Conference2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009
    CountryTaiwan, Province of China
    CityTaipei
    Period09/11/1609/11/18

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    ASJC Scopus subject areas

    • Hardware and Architecture
    • Electrical and Electronic Engineering

    Cite this

    Kasuga, K., Saito, M., Takeya, T., Miura, N., Ishikuro, H., & Kuroda, T. (2009). A wafer test method of inductive-coupling link. In Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009 (pp. 301-304). [5357251] (Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009). https://doi.org/10.1109/ASSCC.2009.5357251