A wafer test method of inductive-coupling link

Kazutaka Kasuga; Mitsuko Saito; Tsutomu Takeya; Noriyuki Miura; Hiroki Ishikuro; Tadahiro Kuroda

doi:10.1109/ASSCC.2009.5357251

A wafer test method of inductive-coupling link

Kazutaka Kasuga, Mitsuko Saito, Tsutomu Takeya, Noriyuki Miura, Hiroki Ishikuro, Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

6 Citations (Scopus)

Abstract

This paper provides the method for Wafer test of an inductive-coupling link. The inductive-coupling link can be tested whether it operates correctly before stacking chips. We provided the method that verify the operation of an inductive-coupling link from the relation between coupling coefficient of inductors and power that transmitter consumes.

Original language	English
Title of host publication	Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009
Pages	301-304
Number of pages	4
DOIs	https://doi.org/10.1109/ASSCC.2009.5357251
Publication status	Published - 2009 Dec 1
Event	2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009 - Taipei, Taiwan, Province of China Duration: 2009 Nov 16 → 2009 Nov 18

Publication series

Name	Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009

Conference

Conference	2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009
Country/Territory	Taiwan, Province of China
City	Taipei
Period	09/11/16 → 09/11/18

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/ASSCC.2009.5357251

Cite this

Kasuga, K., Saito, M., Takeya, T., Miura, N., Ishikuro, H., & Kuroda, T. (2009). A wafer test method of inductive-coupling link. In Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009 (pp. 301-304). [5357251] (Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009). https://doi.org/10.1109/ASSCC.2009.5357251

A wafer test method of inductive-coupling link. / Kasuga, Kazutaka; Saito, Mitsuko; Takeya, Tsutomu et al.

Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009. 2009. p. 301-304 5357251 (Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kasuga, K, Saito, M, Takeya, T, Miura, N, Ishikuro, H & Kuroda, T 2009, A wafer test method of inductive-coupling link. in Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009., 5357251, Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009, pp. 301-304, 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009, Taipei, Taiwan, Province of China, 09/11/16. https://doi.org/10.1109/ASSCC.2009.5357251

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AB - This paper provides the method for Wafer test of an inductive-coupling link. The inductive-coupling link can be tested whether it operates correctly before stacking chips. We provided the method that verify the operation of an inductive-coupling link from the relation between coupling coefficient of inductors and power that transmitter consumes.

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A wafer test method of inductive-coupling link

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