Active crosstalk cancel for high-density inductive inter-chip wireless communication

Amit Kumar, Noriyuki Miura, Muhammad Muqsith, Tadahiro Kuroda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    3 Citations (Scopus)

    Abstract

    A 1.2Gb/s/channel inductive inter-chip wireless interconnect is reported in ISSCC 2004. For high data bandwidth in this scheme, high density inductor layout is required, but closer layout of inductors on chip also increases the crosstalk between channels. In this paper a theory is introduced to reduce the crosstalk between wireless channels based on the inverse matrix, which in turn helps in reducing the pitch of the inductor layout. The simulations were done for a communication distance of 15μm and for varying inductor pitch layout from 10μm to 50μm. Simulink simulations show that for the same Signal to Noise Ratio (SNR) the Bit Error Rate (BER) can be improved for the given pitch. Circuit implementations are proposed and Spice simulations show that the pitch of the inductor layout can be decreased only with the help of change in layout from 25μm to 15μm for SNR of 15db.

    Original languageEnglish
    Title of host publicationProceedings - 19th International Conference on VLSI Design held jointly with 5th International Conference on Embedded Systems Design
    Pages271-276
    Number of pages6
    DOIs
    Publication statusPublished - 2006 Sep 18
    Event19th International Conference on VLSI Design held jointly with 5th International Conference on Embedded Systems Design - Hyderabad, India
    Duration: 2006 Jan 32006 Jan 7

    Publication series

    NameProceedings of the IEEE International Conference on VLSI Design
    Volume2006
    ISSN (Print)1063-9667

    Other

    Other19th International Conference on VLSI Design held jointly with 5th International Conference on Embedded Systems Design
    CountryIndia
    CityHyderabad
    Period06/1/306/1/7

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    ASJC Scopus subject areas

    • Hardware and Architecture
    • Electrical and Electronic Engineering

    Cite this

    Kumar, A., Miura, N., Muqsith, M., & Kuroda, T. (2006). Active crosstalk cancel for high-density inductive inter-chip wireless communication. In Proceedings - 19th International Conference on VLSI Design held jointly with 5th International Conference on Embedded Systems Design (pp. 271-276). [1581464] (Proceedings of the IEEE International Conference on VLSI Design; Vol. 2006). https://doi.org/10.1109/VLSID.2006.31