Active crosstalk cancel for high-density inductive inter-chip wireless communication

Amit Kumar, Noriyuki Miura, Muhammad Muqsith, Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

A 1.2Gb/s/channel inductive inter-chip wireless interconnect is reported in ISSCC 2004. For high data bandwidth in this scheme, high density inductor layout is required, but closer layout of inductors on chip also increases the crosstalk between channels. In this paper a theory is introduced to reduce the crosstalk between wireless channels based on the inverse matrix, which in turn helps in reducing the pitch of the inductor layout. The simulations were done for a communication distance of 15μm and for varying inductor pitch layout from 10μm to 50μm. Simulink simulations show that for the same Signal to Noise Ratio (SNR) the Bit Error Rate (BER) can be improved for the given pitch. Circuit implementations are proposed and Spice simulations show that the pitch of the inductor layout can be decreased only with the help of change in layout from 25μm to 15μm for SNR of 15db.

Original languageEnglish
Title of host publicationProceedings of the IEEE International Conference on VLSI Design
Pages271-276
Number of pages6
Volume2006
DOIs
Publication statusPublished - 2006
Event19th International Conference on VLSI Design held jointly with 5th International Conference on Embedded Systems Design - Hyderabad, India
Duration: 2006 Jan 32006 Jan 7

Other

Other19th International Conference on VLSI Design held jointly with 5th International Conference on Embedded Systems Design
CountryIndia
CityHyderabad
Period06/1/306/1/7

Fingerprint

Crosstalk
Signal to noise ratio
Communication
Bit error rate
Bandwidth
Networks (circuits)
Wireless interconnects

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Kumar, A., Miura, N., Muqsith, M., & Kuroda, T. (2006). Active crosstalk cancel for high-density inductive inter-chip wireless communication. In Proceedings of the IEEE International Conference on VLSI Design (Vol. 2006, pp. 271-276). [1581464] https://doi.org/10.1109/VLSID.2006.31

Active crosstalk cancel for high-density inductive inter-chip wireless communication. / Kumar, Amit; Miura, Noriyuki; Muqsith, Muhammad; Kuroda, Tadahiro.

Proceedings of the IEEE International Conference on VLSI Design. Vol. 2006 2006. p. 271-276 1581464.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kumar, A, Miura, N, Muqsith, M & Kuroda, T 2006, Active crosstalk cancel for high-density inductive inter-chip wireless communication. in Proceedings of the IEEE International Conference on VLSI Design. vol. 2006, 1581464, pp. 271-276, 19th International Conference on VLSI Design held jointly with 5th International Conference on Embedded Systems Design, Hyderabad, India, 06/1/3. https://doi.org/10.1109/VLSID.2006.31
Kumar A, Miura N, Muqsith M, Kuroda T. Active crosstalk cancel for high-density inductive inter-chip wireless communication. In Proceedings of the IEEE International Conference on VLSI Design. Vol. 2006. 2006. p. 271-276. 1581464 https://doi.org/10.1109/VLSID.2006.31
Kumar, Amit ; Miura, Noriyuki ; Muqsith, Muhammad ; Kuroda, Tadahiro. / Active crosstalk cancel for high-density inductive inter-chip wireless communication. Proceedings of the IEEE International Conference on VLSI Design. Vol. 2006 2006. pp. 271-276
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