Adhesion energy of Cu/polyimide interface in flexible printed circuits

Shoji Kamiya, Harunori Furuta, Masaki Omiya

Research output: Contribution to journalArticle

35 Citations (Scopus)

Abstract

The adhesion strength of interfaces was evaluated for two Cu/polyimide laminates, which had the same interface but different polyimide film thickness. A new technique was applied to evaluate the bond energy of the interface, where micro scale polyimide film blocks were scratched off from the interface-side surface of the copper film. Energy consumed during plastic deformation was successfully calculated with the help of a numerical simulation for crack extension. Contrary to the results of conventional peel tests which yielded 340 J/m 2 and 580 J/m 2, respectively for the two samples, the interfacial adhesion energy was obtained as 30 J/m 2 and 25 J/m 2 by the new technique.

Original languageEnglish
Pages (from-to)1084-1088
Number of pages5
JournalSurface and Coatings Technology
Volume202
Issue number4-7
DOIs
Publication statusPublished - 2007 Dec 15
Externally publishedYes

Fingerprint

Printed circuits
printed circuits
polyimides
Polyimides
adhesion
Adhesion
energy
Bond strength (materials)
laminates
plastic deformation
Laminates
Film thickness
Copper
Plastic deformation
film thickness
cracks
Cracks
copper
Computer simulation
simulation

Keywords

  • Adhesion
  • Cu/polyimide interface
  • Energy
  • Flexible printed circuit
  • Plastic deformation
  • Strength

ASJC Scopus subject areas

  • Surfaces, Coatings and Films
  • Condensed Matter Physics
  • Surfaces and Interfaces

Cite this

Adhesion energy of Cu/polyimide interface in flexible printed circuits. / Kamiya, Shoji; Furuta, Harunori; Omiya, Masaki.

In: Surface and Coatings Technology, Vol. 202, No. 4-7, 15.12.2007, p. 1084-1088.

Research output: Contribution to journalArticle

Kamiya, Shoji ; Furuta, Harunori ; Omiya, Masaki. / Adhesion energy of Cu/polyimide interface in flexible printed circuits. In: Surface and Coatings Technology. 2007 ; Vol. 202, No. 4-7. pp. 1084-1088.
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