Adhesion energy of Cu/polyimide interface in flexible printed circuits

Shoji Kamiya; Harunori Furuta; Masaki Omiya

doi:10.1016/j.surfcoat.2007.07.061

Adhesion energy of Cu/polyimide interface in flexible printed circuits

Shoji Kamiya, Harunori Furuta, Masaki Omiya

Research output: Contribution to journal › Article › peer-review

41 Citations (Scopus)

Abstract

The adhesion strength of interfaces was evaluated for two Cu/polyimide laminates, which had the same interface but different polyimide film thickness. A new technique was applied to evaluate the bond energy of the interface, where micro scale polyimide film blocks were scratched off from the interface-side surface of the copper film. Energy consumed during plastic deformation was successfully calculated with the help of a numerical simulation for crack extension. Contrary to the results of conventional peel tests which yielded 340 J/m ² and 580 J/m ², respectively for the two samples, the interfacial adhesion energy was obtained as 30 J/m ² and 25 J/m ² by the new technique.

Original language	English
Pages (from-to)	1084-1088
Number of pages	5
Journal	Surface and Coatings Technology
Volume	202
Issue number	4-7
DOIs	https://doi.org/10.1016/j.surfcoat.2007.07.061
Publication status	Published - 2007 Dec 15
Externally published	Yes

Keywords

Adhesion
Cu/polyimide interface
Energy
Flexible printed circuit
Plastic deformation
Strength

ASJC Scopus subject areas

Chemistry(all)
Condensed Matter Physics
Surfaces and Interfaces
Surfaces, Coatings and Films
Materials Chemistry

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10.1016/j.surfcoat.2007.07.061

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title = "Adhesion energy of Cu/polyimide interface in flexible printed circuits",

abstract = "The adhesion strength of interfaces was evaluated for two Cu/polyimide laminates, which had the same interface but different polyimide film thickness. A new technique was applied to evaluate the bond energy of the interface, where micro scale polyimide film blocks were scratched off from the interface-side surface of the copper film. Energy consumed during plastic deformation was successfully calculated with the help of a numerical simulation for crack extension. Contrary to the results of conventional peel tests which yielded 340 J/m 2 and 580 J/m 2, respectively for the two samples, the interfacial adhesion energy was obtained as 30 J/m 2 and 25 J/m 2 by the new technique.",

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T1 - Adhesion energy of Cu/polyimide interface in flexible printed circuits

AU - Kamiya, Shoji

AU - Furuta, Harunori

AU - Omiya, Masaki

PY - 2007/12/15

Y1 - 2007/12/15

N2 - The adhesion strength of interfaces was evaluated for two Cu/polyimide laminates, which had the same interface but different polyimide film thickness. A new technique was applied to evaluate the bond energy of the interface, where micro scale polyimide film blocks were scratched off from the interface-side surface of the copper film. Energy consumed during plastic deformation was successfully calculated with the help of a numerical simulation for crack extension. Contrary to the results of conventional peel tests which yielded 340 J/m 2 and 580 J/m 2, respectively for the two samples, the interfacial adhesion energy was obtained as 30 J/m 2 and 25 J/m 2 by the new technique.

AB - The adhesion strength of interfaces was evaluated for two Cu/polyimide laminates, which had the same interface but different polyimide film thickness. A new technique was applied to evaluate the bond energy of the interface, where micro scale polyimide film blocks were scratched off from the interface-side surface of the copper film. Energy consumed during plastic deformation was successfully calculated with the help of a numerical simulation for crack extension. Contrary to the results of conventional peel tests which yielded 340 J/m 2 and 580 J/m 2, respectively for the two samples, the interfacial adhesion energy was obtained as 30 J/m 2 and 25 J/m 2 by the new technique.

KW - Adhesion

KW - Cu/polyimide interface

KW - Energy

KW - Flexible printed circuit

KW - Plastic deformation

KW - Strength

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Adhesion energy of Cu/polyimide interface in flexible printed circuits

Abstract

Keywords

ASJC Scopus subject areas

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