Advanced atm switching system hardware technologies based on mcm-d for atm line interface circuits

Tomoaki Kawamura, Naoaki Yamanaka, Katsumi Kaizu

Research output: Contribution to journalArticle

Abstract

This paper describes advanced ATM switching system hardware that uses a high-performance and cost-effective MCM-D module as an ATM-layer function device. The MCM-D module is fabricated on a Si-substrate using the stacking RAM technique to reduce module size. The MCM has a 4-layer Si substrate, a high-performance ASIC, 8 high-speed SRAMs, and an FPGA. By using the stacking RAM technique, MCM-D module size is reduced to 50.8mm x 50.8mm. This is 40% ofthat (100mm x 65mm) of a double-side mounted sub-board module with conventional packaging (QFP and SOP). The MCM-D module realizes the ATM-layer functions that require a highperformance ASIC with a high-speed (access time 20ns) and large-capacity (l MBytes) SRAM cache. The MCM approach is quite effective in increasing memory access speed because it realizes high-density packaging. The MCM-D module is mounted on an ATM line interface circuit, and realizes 150 Mbit/s throughput ATM-layer functions (header conversion and on-line monitoring) in an ATM switching system. In addition, advanced ATM switching system hardware technologies with sub-module structure are also described. The MCM-D module is one of the sub-modules of the system. This MCM technology and sub-module technology can be applied to advanced ATM switching systems.

Original languageEnglish
Pages (from-to)482-487
Number of pages6
JournalIEICE Transactions on Communications
VolumeE81-B
Issue number2
Publication statusPublished - 1998
Externally publishedYes

Fingerprint

Switching systems
Multicarrier modulation
Automatic teller machines
Interfaces (computer)
Hardware
Networks (circuits)
Static random access storage
Random access storage
Application specific integrated circuits
Computer hardware
Packaging
Substrates
Field programmable gate arrays (FPGA)
Throughput
Data storage equipment
Monitoring

Keywords

  • Assemble
  • ATM
  • MCM
  • Sub-module

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Computer Networks and Communications

Cite this

Advanced atm switching system hardware technologies based on mcm-d for atm line interface circuits. / Kawamura, Tomoaki; Yamanaka, Naoaki; Kaizu, Katsumi.

In: IEICE Transactions on Communications, Vol. E81-B, No. 2, 1998, p. 482-487.

Research output: Contribution to journalArticle

@article{dfa07a1867964dac8be7821bcb6451c0,
title = "Advanced atm switching system hardware technologies based on mcm-d for atm line interface circuits",
abstract = "This paper describes advanced ATM switching system hardware that uses a high-performance and cost-effective MCM-D module as an ATM-layer function device. The MCM-D module is fabricated on a Si-substrate using the stacking RAM technique to reduce module size. The MCM has a 4-layer Si substrate, a high-performance ASIC, 8 high-speed SRAMs, and an FPGA. By using the stacking RAM technique, MCM-D module size is reduced to 50.8mm x 50.8mm. This is 40{\%} ofthat (100mm x 65mm) of a double-side mounted sub-board module with conventional packaging (QFP and SOP). The MCM-D module realizes the ATM-layer functions that require a highperformance ASIC with a high-speed (access time 20ns) and large-capacity (l MBytes) SRAM cache. The MCM approach is quite effective in increasing memory access speed because it realizes high-density packaging. The MCM-D module is mounted on an ATM line interface circuit, and realizes 150 Mbit/s throughput ATM-layer functions (header conversion and on-line monitoring) in an ATM switching system. In addition, advanced ATM switching system hardware technologies with sub-module structure are also described. The MCM-D module is one of the sub-modules of the system. This MCM technology and sub-module technology can be applied to advanced ATM switching systems.",
keywords = "Assemble, ATM, MCM, Sub-module",
author = "Tomoaki Kawamura and Naoaki Yamanaka and Katsumi Kaizu",
year = "1998",
language = "English",
volume = "E81-B",
pages = "482--487",
journal = "IEICE Transactions on Communications",
issn = "0916-8516",
publisher = "Maruzen Co., Ltd/Maruzen Kabushikikaisha",
number = "2",

}

TY - JOUR

T1 - Advanced atm switching system hardware technologies based on mcm-d for atm line interface circuits

AU - Kawamura, Tomoaki

AU - Yamanaka, Naoaki

AU - Kaizu, Katsumi

PY - 1998

Y1 - 1998

N2 - This paper describes advanced ATM switching system hardware that uses a high-performance and cost-effective MCM-D module as an ATM-layer function device. The MCM-D module is fabricated on a Si-substrate using the stacking RAM technique to reduce module size. The MCM has a 4-layer Si substrate, a high-performance ASIC, 8 high-speed SRAMs, and an FPGA. By using the stacking RAM technique, MCM-D module size is reduced to 50.8mm x 50.8mm. This is 40% ofthat (100mm x 65mm) of a double-side mounted sub-board module with conventional packaging (QFP and SOP). The MCM-D module realizes the ATM-layer functions that require a highperformance ASIC with a high-speed (access time 20ns) and large-capacity (l MBytes) SRAM cache. The MCM approach is quite effective in increasing memory access speed because it realizes high-density packaging. The MCM-D module is mounted on an ATM line interface circuit, and realizes 150 Mbit/s throughput ATM-layer functions (header conversion and on-line monitoring) in an ATM switching system. In addition, advanced ATM switching system hardware technologies with sub-module structure are also described. The MCM-D module is one of the sub-modules of the system. This MCM technology and sub-module technology can be applied to advanced ATM switching systems.

AB - This paper describes advanced ATM switching system hardware that uses a high-performance and cost-effective MCM-D module as an ATM-layer function device. The MCM-D module is fabricated on a Si-substrate using the stacking RAM technique to reduce module size. The MCM has a 4-layer Si substrate, a high-performance ASIC, 8 high-speed SRAMs, and an FPGA. By using the stacking RAM technique, MCM-D module size is reduced to 50.8mm x 50.8mm. This is 40% ofthat (100mm x 65mm) of a double-side mounted sub-board module with conventional packaging (QFP and SOP). The MCM-D module realizes the ATM-layer functions that require a highperformance ASIC with a high-speed (access time 20ns) and large-capacity (l MBytes) SRAM cache. The MCM approach is quite effective in increasing memory access speed because it realizes high-density packaging. The MCM-D module is mounted on an ATM line interface circuit, and realizes 150 Mbit/s throughput ATM-layer functions (header conversion and on-line monitoring) in an ATM switching system. In addition, advanced ATM switching system hardware technologies with sub-module structure are also described. The MCM-D module is one of the sub-modules of the system. This MCM technology and sub-module technology can be applied to advanced ATM switching systems.

KW - Assemble

KW - ATM

KW - MCM

KW - Sub-module

UR - http://www.scopus.com/inward/record.url?scp=0032000133&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0032000133&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:0032000133

VL - E81-B

SP - 482

EP - 487

JO - IEICE Transactions on Communications

JF - IEICE Transactions on Communications

SN - 0916-8516

IS - 2

ER -