Advanced ATM switching system hardware technology using MCM-D, stacking RAM microprocessor module

N. Yamanaka, T. Kawamura, K. Kaizu, A. Harada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper describes newly developed advanced ATM switching system hardware structures based on MCM-D micro-processor modules. The Si-Substrate MCM-D technology which integrates micro-processor, interface control and peripheral control custom VLSIs, high-speed S-RAMS, and FPGAs (Field Programmable Gate Arrays) is employed. An MCM-D micro-processor module is realized by combining a Motorola 68030, high-performance ASICs, and high-speed S-RAM caches. This is made possible by high density packaging and high-speed 4M-byte with parity cache using 25 ns access to 4-Mbit of S-RAM memory. The MCM employs 12 S-RAMS, possible with the stacked RAM technique, to reduce the module size by 718 compared to conventional surface mounting modules. This micro-processor module technology and MCM technology will advance the development of practical B-ISDN ATM switching systems.

Original languageEnglish
Title of host publication1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages884-888
Number of pages5
ISBN (Print)0780345266
DOIs
Publication statusPublished - 1998 Jan 1
Externally publishedYes
Event48th Electronic Components and Technology Conference, ECTC 1998 - Seattle, United States
Duration: 1998 May 251998 May 28

Publication series

NameProceedings - Electronic Components and Technology Conference
VolumePart F133492
ISSN (Print)0569-5503

Conference

Conference48th Electronic Components and Technology Conference, ECTC 1998
CountryUnited States
CitySeattle
Period98/5/2598/5/28

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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    Yamanaka, N., Kawamura, T., Kaizu, K., & Harada, A. (1998). Advanced ATM switching system hardware technology using MCM-D, stacking RAM microprocessor module. In 1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998 (pp. 884-888). [678812] (Proceedings - Electronic Components and Technology Conference; Vol. Part F133492). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.1998.678812