Abstract
This paper describes newly developed advanced ATM switching system hardware structures. They are based on the Si-Substrate MCM-D technology which integrates ASIC custom VLSIs, high-speed S-RAMs and FPGAs (Field Programmable Gate Arrays). The MCM-D module realizes the ATM layer function by combining a high-performance ASIC with high-speed S-RAM cache. This is made possible by high density packaging and high-speed (20 ns) access to 1-Mbit of memory. The MCM employs 8 S-RAMs, possible with the stacked RAM technique, to reduce module size. This sub-module technology and MCM technology will advance the development of practical B-ISDN ATM switching systems.
Original language | English |
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Pages | 286-289 |
Number of pages | 4 |
Publication status | Published - 1997 Jan 1 |
Externally published | Yes |
Event | Proceedings of the 1997 IEEE/CPMT 20th International Electronic Manufacturing Symposium - Tokyo, Jpn Duration: 1997 Apr 16 → 1997 Apr 18 |
Other
Other | Proceedings of the 1997 IEEE/CPMT 20th International Electronic Manufacturing Symposium |
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City | Tokyo, Jpn |
Period | 97/4/16 → 97/4/18 |
ASJC Scopus subject areas
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering