Advanced MCM-D micro-processor module for ATM wide-area network switching systems

Tomoaki Kawamura, Naoaki Yamanaka, Katsumi Kaizu, Akio Harada, Zenichi Yashiro

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper describes an advanced MCM-D micro-processor module and its high-performance cooling technologies for an ATM-WAN (Wide-Area Network) switching system. The MCM-D module is fabricated on 2 Si-substrates using the stacking RAM technique to reduce module size. The MCM has 4-layer Si substrates, a micro-processor LSI, 4 ASIC-LSIs, 12 high-speed SRAMs, an FPGA and bus-driver ICs. By using the stacking RAM technique, MCM-D module size was reduced to 65 mm×85 mm. This is 14% of that (200 mm×200 mm) of assembly area of a conventional circuit using conventional packaging technologies. The MCM-D module was mounted on an ATM line interface circuit board, and realized 25 MHz micro-processor functions with high-speed (access time 25 ns) and large-capacity (4 MBytes) SRAM cache and ATM line interface circuit functions in an ATM-WAN switching system. The line interface circuit board mounted the MCM-D module has high-performance cooling architecture without fin-structure. The MCM-D module is mounted on a sub-board and has thermal contact to the main board through a rubber with low thermal resistance. By using this high-performance cooling architecture, the MCM-D micro-processor module and the ATM line interface circuit board operate under conventional forced air cooling condition without fin-structure. This MCM technology and high-performance cooling technology can be applied to ATM-WAN switching systems and future B-ISDN ATM switching systems.

Original languageEnglish
Title of host publicationProceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
Editors Anon
PublisherIEEE
Pages21-26
Number of pages6
Publication statusPublished - 1998
Externally publishedYes
EventProceedings of the 1998 22nd IEEE/CPMT International Electronics Manufacturing Technology Symposium - Berlin, Ger
Duration: 1998 Apr 271998 Apr 29

Other

OtherProceedings of the 1998 22nd IEEE/CPMT International Electronics Manufacturing Technology Symposium
CityBerlin, Ger
Period98/4/2798/4/29

Fingerprint

Wide area networks
Switching systems
Automatic teller machines
Multicarrier modulation
Interfaces (computer)
Cooling
Networks (circuits)
Fins (heat exchange)
Static random access storage
Random access storage
Program processors
Bus drivers
Voice/data communication systems
Substrates
Application specific integrated circuits
Heat resistance
Field programmable gate arrays (FPGA)
Packaging
Rubber

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Kawamura, T., Yamanaka, N., Kaizu, K., Harada, A., & Yashiro, Z. (1998). Advanced MCM-D micro-processor module for ATM wide-area network switching systems. In Anon (Ed.), Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium (pp. 21-26). IEEE.

Advanced MCM-D micro-processor module for ATM wide-area network switching systems. / Kawamura, Tomoaki; Yamanaka, Naoaki; Kaizu, Katsumi; Harada, Akio; Yashiro, Zenichi.

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. ed. / Anon. IEEE, 1998. p. 21-26.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kawamura, T, Yamanaka, N, Kaizu, K, Harada, A & Yashiro, Z 1998, Advanced MCM-D micro-processor module for ATM wide-area network switching systems. in Anon (ed.), Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. IEEE, pp. 21-26, Proceedings of the 1998 22nd IEEE/CPMT International Electronics Manufacturing Technology Symposium, Berlin, Ger, 98/4/27.
Kawamura T, Yamanaka N, Kaizu K, Harada A, Yashiro Z. Advanced MCM-D micro-processor module for ATM wide-area network switching systems. In Anon, editor, Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. IEEE. 1998. p. 21-26
Kawamura, Tomoaki ; Yamanaka, Naoaki ; Kaizu, Katsumi ; Harada, Akio ; Yashiro, Zenichi. / Advanced MCM-D micro-processor module for ATM wide-area network switching systems. Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium. editor / Anon. IEEE, 1998. pp. 21-26
@inproceedings{65fee3414c184a01869cf2b337ec1e18,
title = "Advanced MCM-D micro-processor module for ATM wide-area network switching systems",
abstract = "This paper describes an advanced MCM-D micro-processor module and its high-performance cooling technologies for an ATM-WAN (Wide-Area Network) switching system. The MCM-D module is fabricated on 2 Si-substrates using the stacking RAM technique to reduce module size. The MCM has 4-layer Si substrates, a micro-processor LSI, 4 ASIC-LSIs, 12 high-speed SRAMs, an FPGA and bus-driver ICs. By using the stacking RAM technique, MCM-D module size was reduced to 65 mm×85 mm. This is 14{\%} of that (200 mm×200 mm) of assembly area of a conventional circuit using conventional packaging technologies. The MCM-D module was mounted on an ATM line interface circuit board, and realized 25 MHz micro-processor functions with high-speed (access time 25 ns) and large-capacity (4 MBytes) SRAM cache and ATM line interface circuit functions in an ATM-WAN switching system. The line interface circuit board mounted the MCM-D module has high-performance cooling architecture without fin-structure. The MCM-D module is mounted on a sub-board and has thermal contact to the main board through a rubber with low thermal resistance. By using this high-performance cooling architecture, the MCM-D micro-processor module and the ATM line interface circuit board operate under conventional forced air cooling condition without fin-structure. This MCM technology and high-performance cooling technology can be applied to ATM-WAN switching systems and future B-ISDN ATM switching systems.",
author = "Tomoaki Kawamura and Naoaki Yamanaka and Katsumi Kaizu and Akio Harada and Zenichi Yashiro",
year = "1998",
language = "English",
pages = "21--26",
editor = "Anon",
booktitle = "Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium",
publisher = "IEEE",

}

TY - GEN

T1 - Advanced MCM-D micro-processor module for ATM wide-area network switching systems

AU - Kawamura, Tomoaki

AU - Yamanaka, Naoaki

AU - Kaizu, Katsumi

AU - Harada, Akio

AU - Yashiro, Zenichi

PY - 1998

Y1 - 1998

N2 - This paper describes an advanced MCM-D micro-processor module and its high-performance cooling technologies for an ATM-WAN (Wide-Area Network) switching system. The MCM-D module is fabricated on 2 Si-substrates using the stacking RAM technique to reduce module size. The MCM has 4-layer Si substrates, a micro-processor LSI, 4 ASIC-LSIs, 12 high-speed SRAMs, an FPGA and bus-driver ICs. By using the stacking RAM technique, MCM-D module size was reduced to 65 mm×85 mm. This is 14% of that (200 mm×200 mm) of assembly area of a conventional circuit using conventional packaging technologies. The MCM-D module was mounted on an ATM line interface circuit board, and realized 25 MHz micro-processor functions with high-speed (access time 25 ns) and large-capacity (4 MBytes) SRAM cache and ATM line interface circuit functions in an ATM-WAN switching system. The line interface circuit board mounted the MCM-D module has high-performance cooling architecture without fin-structure. The MCM-D module is mounted on a sub-board and has thermal contact to the main board through a rubber with low thermal resistance. By using this high-performance cooling architecture, the MCM-D micro-processor module and the ATM line interface circuit board operate under conventional forced air cooling condition without fin-structure. This MCM technology and high-performance cooling technology can be applied to ATM-WAN switching systems and future B-ISDN ATM switching systems.

AB - This paper describes an advanced MCM-D micro-processor module and its high-performance cooling technologies for an ATM-WAN (Wide-Area Network) switching system. The MCM-D module is fabricated on 2 Si-substrates using the stacking RAM technique to reduce module size. The MCM has 4-layer Si substrates, a micro-processor LSI, 4 ASIC-LSIs, 12 high-speed SRAMs, an FPGA and bus-driver ICs. By using the stacking RAM technique, MCM-D module size was reduced to 65 mm×85 mm. This is 14% of that (200 mm×200 mm) of assembly area of a conventional circuit using conventional packaging technologies. The MCM-D module was mounted on an ATM line interface circuit board, and realized 25 MHz micro-processor functions with high-speed (access time 25 ns) and large-capacity (4 MBytes) SRAM cache and ATM line interface circuit functions in an ATM-WAN switching system. The line interface circuit board mounted the MCM-D module has high-performance cooling architecture without fin-structure. The MCM-D module is mounted on a sub-board and has thermal contact to the main board through a rubber with low thermal resistance. By using this high-performance cooling architecture, the MCM-D micro-processor module and the ATM line interface circuit board operate under conventional forced air cooling condition without fin-structure. This MCM technology and high-performance cooling technology can be applied to ATM-WAN switching systems and future B-ISDN ATM switching systems.

UR - http://www.scopus.com/inward/record.url?scp=0031632340&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0031632340&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0031632340

SP - 21

EP - 26

BT - Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

A2 - Anon, null

PB - IEEE

ER -