TY - GEN
T1 - An 11Gb/s inductive-coupling link with burst transmission
AU - Miura, Noriyuki
AU - Kohama, Yoshinori
AU - Sugimori, Yasufumi
AU - Ishikuro, Hiroki
AU - Sakurai, Takayasu
AU - Kuroda, Tadahiro
PY - 2008
Y1 - 2008
N2 - An 11 Gb/s inductive-coupling link in 0.18μm CMOS demonstrates an energy efficiency of 1.4pJ/b and delivers a data rate 11× higher than previous inductive-coupling links. Communication distance is5× longer than a capacitive-coupling link for the same data rate, layout area, and BER. Burst transmission at 6.4Gb/s reduces layout area by a factor of three.
AB - An 11 Gb/s inductive-coupling link in 0.18μm CMOS demonstrates an energy efficiency of 1.4pJ/b and delivers a data rate 11× higher than previous inductive-coupling links. Communication distance is5× longer than a capacitive-coupling link for the same data rate, layout area, and BER. Burst transmission at 6.4Gb/s reduces layout area by a factor of three.
UR - http://www.scopus.com/inward/record.url?scp=49549087966&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=49549087966&partnerID=8YFLogxK
U2 - 10.1109/ISSCC.2008.4523175
DO - 10.1109/ISSCC.2008.4523175
M3 - Conference contribution
AN - SCOPUS:49549087966
SN - 9781424420100
T3 - Digest of Technical Papers - IEEE International Solid-State Circuits Conference
SP - 297
EP - 299
BT - 2008 IEEE International Solid State Circuits Conference - Digest of Technical Papers, ISSCC
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2008 IEEE International Solid State Circuits Conference, ISSCC
Y2 - 3 February 2008 through 7 February 2008
ER -