Abstract
One promising solution to the recent demands of today's communications-oriented society for a high-speed and large-capacity telecommunications network is an asynchronous transfer mode (ATM) switching system. Since multichip modules (MCMs) support high-density mounting and high-speed interconnection among LSIs, we have developed an 80-Gbit/s ATM switch MCM using an alumina substrate.
Original language | English |
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Pages (from-to) | 556-560 |
Number of pages | 5 |
Journal | journal of the japan institute of electronics packaging |
Volume | 2 |
Issue number | 7 |
DOIs | |
Publication status | Published - 2002 |
Externally published | Yes |
Keywords
- ATM Switch
- FPC
- High-Speed Interconnection
- Liquid Cooling
- MCM
- Stack Connector
ASJC Scopus subject areas
- Electrical and Electronic Engineering